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LF357 데이터시트(PDF) 2 Page - National Semiconductor (TI) |
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LF357 데이터시트(HTML) 2 Page - National Semiconductor (TI) |
2 / 23 page Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, contact the National Semiconductor Sales Office/Distributors for availability and specifications. LF155/6 LF256/7/LF356B LF355/6/7 Supply Voltage ±22V ±22V ±18V Differential Input Voltage ±40V ±40V ±30V Input Voltage Range (Note 2) ±20V ±20V ±16V Output Short Circuit Duration Continuous Continuous Continuous T JMAX H-Package 150˚C 115˚C 115˚C N-Package 100˚C 100˚C M-Package 100˚C 100˚C Power Dissipation at T A = 25˚C (Notes 1, 8) H-Package (Still Air) 560 mW 400 mW 400 mW H-Package (400 LF/Min Air Flow) 1200 mW 1000 mW 1000 mW N-Package 670 mW 670 mW M-Package 380 mW 380 mW Thermal Resistance (Typical) θ JA H-Package (Still Air) 160˚C/W 160˚C/W 160˚C/W H-Package (400 LF/Min Air Flow) 65˚C/W 65˚C/W 65˚C/W N-Package 130˚C/W 130˚C/W M-Package 195˚C/W 195˚C/W (Typical) θ JC H-Package 23˚C/W 23˚C/W 23˚C/W Storage Temperature Range −65˚C to +150˚C −65˚C to +150˚C −65˚C to +150˚C Soldering Information (Lead Temp.) Metal Can Package Soldering (10 sec.) 300˚C 300˚C 300˚C Dual-In-Line Package Soldering (10 sec.) 260˚C 260˚C 260˚C Small Outline Package Vapor Phase (60 sec.) 215˚C 215˚C Infrared (15 sec.) 220˚C 220˚C See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. ESD tolerance (100 pF discharged through 1.5k Ω) 1000V 1000V 1000V DC Electrical Characteristics (Note 3) Symbol Parameter Conditions LF155/6 LF256/7 LF356B LF355/6/7 Units Min Typ Max Min Typ Max Min Typ Max V OS Input Offset Voltage R S=50Ω,TA=25˚C 3 5 3 5 3 10 mV Over Temperature 7 6.5 13 mV ∆V OS/∆T Average TC of Input Offset Voltage R S=50Ω 5 5 5 µV/˚C ∆TC/∆V OS Change in Average TC with V OS Adjust R S=50Ω, (Note 4) 0.5 0.5 0.5 µV/˚C per mV I OS Input Offset Current T J=25˚C, (Notes 3, 5) 3 20 3 20 3 50 pA T J≤THIGH 20 1 2 nA www.national.com 2 |
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