전자부품 데이터시트 검색엔진 |
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DRV10974 데이터시트(PDF) 26 Page - Texas Instruments |
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DRV10974 데이터시트(HTML) 26 Page - Texas Instruments |
26 / 29 page www.ti.com PACKAGE OUTLINE C 14X 0.65 2X 4.55 16X 0.30 0.19 TYP 6.6 6.2 0.15 0.05 0.25 GAGE PLANE -8 0 1.2 MAX 3.55 2.68 2.46 1.75 B 4.5 4.3 A NOTE 3 5.1 4.9 0.75 0.50 (0.15) TYP PowerPAD TSSOP - 1.2 mm max height PWP0016J SMALL OUTLINE PACKAGE 4223595/A 03/2017 1 8 9 16 0.1 C A B PIN 1 INDEX AREA SEE DETAIL A 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-153. SEATING PLANE TM PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL SCALE 2.500 THERMAL PAD 1 8 9 16 |
유사한 부품 번호 - DRV10974 |
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유사한 설명 - DRV10974 |
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