전자부품 데이터시트 검색엔진 |
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GT28F320B3T90 데이터시트(PDF) 9 Page - Intel Corporation |
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GT28F320B3T90 데이터시트(HTML) 9 Page - Intel Corporation |
9 / 48 page E SMART 3 ADVANCED BOOT BLOCK 9 PRELIMINARY A 13 A 14 A 15 A 16 V CCQ A 11 A 10 A 12 D 14 D 15 A 8 WE# A 9 D 5 D 6 V PP RP# D 11 D 12 WP# A 18 A 20 D 2 D 3 A 19 A 17 A 6 D 8 D 9 A 7 A 5 A 3 CE# D 0 A 4 A 2 A 1 A 0 GND GND D 7 D 13 D 4 V CC D 10 D 1 OE# A B C D E F 13 25 47 68 16M 32M 8M 0580_03 NOTES: 1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the upgrade address for the 32-Mbit device. 2. 4-Mbit density not available in µBGA* CSP. Figure 4. x16 48-Ball µBGA* Chip Size Package (Top View, Ball Down) |
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