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FAN25800AUCF27X 데이터시트(PDF) 4 Page - ON Semiconductor |
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FAN25800AUCF27X 데이터시트(HTML) 4 Page - ON Semiconductor |
4 / 11 page ![]() © 2014 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN25800 • Rev. 1.5 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VIN Input Voltage with Respect to GND -0.3 6.0 V VCC Voltage on Any Other Pin (with Respect to GND) -0.3 VIN+0.3 (5) V TJ Junction Temperature -40 +150 °C TSTG Storage Temperature -65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C ESD Electrostatic Discharge Protection Level Human Body Model, ANSI/ESDA/JEDEC JS-001-2012 4000 V Charged Device Model per JESD22-C101 1500 LU Latch Up JESD 78D Note: 5. Lesser of 6.0 V or VIN + 0.3 V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Typ. Max. Unit VIN Supply Voltage 2.3 5.5 (6) V IOUT_MAX (7) Output Current (VOUT = 2.7 V, 3.3 V) 500 mA IOUT_Recommend Output Current (VOUT = 3.3 V) 500 mA Output Current (VOUT = 2.7 V, 2.8 V) 250 mA CIN Input Capacitor (Effective Capacitance) (8) 0.4 0.8 µF COUT Output Capacitor (Effective Capacitance) (8) 0.4 0.8 15.0 µF TA Ambient Temperature –40 +85 °C TJ Junction Temperature –40 +125 °C Note: 6. For VIN ≥ 3.4 V, thermal properties of the device must be taken into account at maximum load of 500 mA; refer to JA thermal properties. 7. IOUT_MAX is for VIN = VOUT + 0.3 V. 8. Effective capacitance, including the effects of bias, tolerance, and temperature. See the Operation Description section for more information. Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature, TJ(max), at a given ambient temperature, TA. Symbol Parameter Typ. Unit JA Junction-to-Ambient Thermal Resistance 180 °C/W |
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