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FAN25800AUCF27X 데이터시트(PDF) 4 Page - ON Semiconductor

부품명 FAN25800AUCF27X
상세설명  Low-Noise, LDO Regulator
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

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© 2014 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN25800
• Rev. 1.5
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VIN
Input Voltage with Respect to GND
-0.3
6.0
V
VCC
Voltage on Any Other Pin (with Respect to GND)
-0.3
VIN+0.3
(5)
V
TJ
Junction Temperature
-40
+150
°C
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+260
°C
ESD
Electrostatic Discharge
Protection Level
Human Body Model,
ANSI/ESDA/JEDEC JS-001-2012
4000
V
Charged Device Model per JESD22-C101
1500
LU
Latch Up
JESD 78D
Note:
5.
Lesser of 6.0 V or VIN + 0.3 V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Typ.
Max.
Unit
VIN
Supply Voltage
2.3
5.5
(6)
V
IOUT_MAX
(7)
Output Current (VOUT = 2.7 V, 3.3 V)
500
mA
IOUT_Recommend Output Current (VOUT = 3.3 V)
500
mA
Output Current (VOUT = 2.7 V, 2.8 V)
250
mA
CIN
Input Capacitor (Effective Capacitance)
(8)
0.4
0.8
µF
COUT
Output Capacitor (Effective Capacitance)
(8)
0.4
0.8
15.0
µF
TA
Ambient Temperature
–40
+85
°C
TJ
Junction Temperature
–40
+125
°C
Note:
6.
For VIN ≥ 3.4 V, thermal properties of the device must be taken into account at maximum load of 500 mA; refer to
JA thermal properties.
7.
IOUT_MAX is for VIN = VOUT + 0.3 V.
8.
Effective capacitance, including the effects of bias, tolerance, and temperature. See the Operation Description
section for more information.
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with
four-layer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed
junction temperature, TJ(max), at a given ambient temperature, TA.
Symbol
Parameter
Typ.
Unit
JA
Junction-to-Ambient Thermal Resistance
180
°C/W


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