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LTM4636-1 데이터시트(PDF) 23 Page - Linear Technology

부품명 LTM4636-1
상세설명  40A 關Module Regulator with Overvoltage/ Overtemperature Protection
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제조업체  LINER [Linear Technology]
홈페이지  http://www.linear.com
Logo LINER - Linear Technology

LTM4636-1 데이터시트(HTML) 23 Page - Linear Technology

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LTM4636-1
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For more information www.linear.com/LTM4636-1
APPLICATIONS INFORMATION
Within the LTM4636-1, be aware there are multiple power
devices and components dissipating power, with a con-
sequence that the thermal resistances relative to different
junctions of components or die are not exactly linear with
respect to total package power loss. To reconcile this
complicationwithoutsacrificingmodelingsimplicity—but
alsonotignoringpracticalrealities—anapproachhasbeen
taken using FEA software modeling along with laboratory
testing in a controlled-environment chamber to reason-
ably define and correlate the thermal resistance values
supplied in this data sheet: (1) Initially, FEA software is
used to accurately build the mechanical geometry of the
LTM4636-1 and the specified PCB with all of the correct
material coefficients along with accurate power loss
source definitions; (2) this model simulates a software-
defined JEDEC environment consistent with JESD51-12
to predict power loss heat flow and temperature readings
at different interfaces that enable the calculation of the
JEDEC-defined thermal resistance values; (3) the model
and FEA software is used to evaluate the LTM4636-1 with
heat sink and airflow; (4) having solved for and analyzed
these thermal resistance values and simulated various
operating conditions in the software model, a thorough
laboratory evaluation replicates the simulated conditions
with thermocouples within a controlled-environment
chamber while operating the device at the same power
loss as that which was simulated. The outcome of this
process and due diligence yields the set of derating curves
shown in this data sheet.
The power loss curves in Figure 10 to Figure 12 can
be used in coordination with the load current derating
curves in Figure 13 to Figure 18 for calculating an
approximate JA thermal resistance for the LTM4636-1
with various airflow conditions. The power loss curves
are taken at room temperature and can be increased
with a multiplicative factor according to the junction
temperature, which is ~1.4 for 120°C. The derating curves
are plotted with the output current starting at 40A and the
ambient temperature increased. The output voltages are
1V, 2.5V and 3.3V. These are chosen to include the lower,
middle and higher output voltage ranges for correlating
the thermal resistance. Thermal models are derived
from several temperature measurements in a controlled
temperature chamber along with thermal modeling
analysis. The junction temperatures are monitored while
ambienttemperatureisincreasedwithandwithoutairflow.
Thepowerlossincreasewithambienttemperaturechange
is factored into the derating curves. The junctions are
maintained at ~125°C maximum while lowering output
current or power with increasing ambient temperature.
The decreased output current will decrease the internal
module loss as ambient temperature is increased.
The monitored junction temperature of 125°C minus
the ambient operating temperature specifies how much
moduletemperaturerisecanbeallowed.Asanexample,in
Figure 14 the load current is derated to ~30A at ~94°C
with no air flow and the power loss for the 12V to 1.0V
at 30A output is about 4.2W. The 4.2W loss is calculated
with the ~3W room temperature loss from the 12V to
1.0V power loss curve at 30A, and the 1.4 multiplying
factor at 125°C junction. If the 94°C ambient temperature
is subtracted from the 125°C junction temperature, then
the difference of 31°C divided by 4.2W equals a 7.4°C/W
JA thermal resistance. Table 2 specifies a 7.2°C/W value
which is very close. Tables 2, 3, and 4 provide equivalent
thermal resistances for 1V, 1.5V and 3.3V outputs with
and without airflow and heat sinking. The derived thermal
resistances in Tables 2 thru 4 for the various conditions
canbemultipliedbythecalculatedpowerlossasafunction
of ambient temperature to derive temperature rise above
ambient, thus maximum junction temperature. Room
temperature power loss curves are provided in Figure 10
through Figure 12. The printed circuit board is a 1.6mm
thick six layer board with two ounce copper for all layers
and one ounce copper for the two inner layers. The PCB
dimensions are 95mm × 76mm.
Safety Considerations
The LTM4636-1 does not provide galvanic isolation
from VIN to VOUT. There is no internal fuse. If required,
a slow blow fuse with a rating twice the maximum input
current needs to be provided to protect each unit from
catastrophic failure.
The fuse or circuit breaker should be selected to limit the
current to the regulator during overvoltage in case of an
internal top MOSFET fault. If the internal top MOSFET
fails, then turning it off will not resolve the overvoltage,
thus the internal bottom MOSFET will turn on indefinitely
trying to protect the load. Under this fault condition, the


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