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LTM8073 데이터시트(PDF) 20 Page - Linear Technology

부품명 LTM8073
상세설명  60VIN, 3A Silent Switcher 關Module Regulator
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제조업체  LINER [Linear Technology]
홈페이지  http://www.linear.com
Logo LINER - Linear Technology

LTM8073 데이터시트(HTML) 20 Page - Linear Technology

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LTM8073
20
8073fa
For more information www.linear.com/LTM8073
applicaTions inForMaTion
air although natural convection causes the air to move.
This value is determined with the part mounted to a JESD
51-9 defined test board, which does not reflect an actual
application or viable operating condition.
θJCbottom is the junction-to-board thermal resistance with
all of the component power dissipation flowing through
the bottom of the package. In the typical µModule regula-
tor, the bulk of the heat flows out the bottom of the pack-
age, but there is always heat flow out into the ambient
environment. As a result, this thermal resistance value
may be useful for comparing packages but the test condi-
tions don’t generally match the user’s application.
θJCtop is determined with nearly all of the component
power dissipation flowing through the top of the pack-
age. As the electrical connections of the typical µModule
regulator are on the bottom of the package, it is rare for
an application to operate such that most of the heat flows
from the junction to the top of the part. As in the case of
θJCbottom, this value may be useful for comparing pack-
ages but the test conditions don’t generally match the
user’s application.
θJB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
µModule regulator and into the board, and is often just
the sum of the θJCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a two sided,
two layer board. This board is described in JESD 51-9.
Given these definitions, it should now be apparent that
none of these thermal coefficients reflects an actual physi-
cal operating condition of a µModule regulator. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 4. The blue resistances are contained
within the µModule regulator, and the green are outside.
The die temperature of the LTM8073 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8073. The bulk of the heat flow out of the LTM8073 is
through the bottom of the package and the pads into the
printed circuit board. Consequently a poor printed circuit
board design can cause excessive heating, resulting in
impaired performance or reliability. Please refer to the PCB
Layout section for printed circuit board design suggestions.
Figure 4: Graphical Representation of the Thermal Resistances Between the Device Junction and Ambient
8073 F04
µMODULE REGULATOR
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
JUNCTION
AMBIENT
CASE (BOTTOM)-TO-BOARD
RESISTANCE


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