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LTM8073 데이터시트(PDF) 20 Page - Linear Technology |
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LTM8073 데이터시트(HTML) 20 Page - Linear Technology |
20 / 26 page LTM8073 20 8073fa For more information www.linear.com/LTM8073 applicaTions inForMaTion air although natural convection causes the air to move. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. θJCbottom is the junction-to-board thermal resistance with all of the component power dissipation flowing through the bottom of the package. In the typical µModule regula- tor, the bulk of the heat flows out the bottom of the pack- age, but there is always heat flow out into the ambient environment. As a result, this thermal resistance value may be useful for comparing packages but the test condi- tions don’t generally match the user’s application. θJCtop is determined with nearly all of the component power dissipation flowing through the top of the pack- age. As the electrical connections of the typical µModule regulator are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junction to the top of the part. As in the case of θJCbottom, this value may be useful for comparing pack- ages but the test conditions don’t generally match the user’s application. θJB is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the µModule regulator and into the board, and is often just the sum of the θJCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two sided, two layer board. This board is described in JESD 51-9. Given these definitions, it should now be apparent that none of these thermal coefficients reflects an actual physi- cal operating condition of a µModule regulator. Thus, none of them can be individually used to accurately predict the thermal performance of the product. Likewise, it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature vs load graphs given in the product’s data sheet. The only appropriate way to use the coefficients is when running a detailed thermal analysis, such as FEA, which considers all of the thermal resistances simultaneously. A graphical representation of these thermal resistances is given in Figure 4. The blue resistances are contained within the µModule regulator, and the green are outside. The die temperature of the LTM8073 must be lower than the maximum rating of 125°C, so care should be taken in the layout of the circuit to ensure good heat sinking of the LTM8073. The bulk of the heat flow out of the LTM8073 is through the bottom of the package and the pads into the printed circuit board. Consequently a poor printed circuit board design can cause excessive heating, resulting in impaired performance or reliability. Please refer to the PCB Layout section for printed circuit board design suggestions. Figure 4: Graphical Representation of the Thermal Resistances Between the Device Junction and Ambient 8073 F04 µMODULE REGULATOR JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION-TO-BOARD RESISTANCE JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD) CASE (TOP)-TO-AMBIENT RESISTANCE BOARD-TO-AMBIENT RESISTANCE JUNCTION-TO-CASE (BOTTOM) RESISTANCE JUNCTION AMBIENT CASE (BOTTOM)-TO-BOARD RESISTANCE |
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