LA-T776 datasheet(11/19 Pages) OSRAM

부품명	LA-T776

상세설명	white SMT package, colorless clear resin

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제조업체	OSRAM [OSRAM GmbH]

홈페이지	http://www.osram.com

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11 / 19 page

Version 1.0 (Replacement in due course)

LA T776

2013-06-28

11

Recommended Solder Pad 9) page 18

Reflow soldering

Empfohlenes Lötpaddesign 9) Seite 18

Reflow-Löten

OHLPY977

1.2 (0.047)

6 (0.236)

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

2

for improved

Wärmeableitung

für verbesserte

Padgeometrie

Paddesign

2

Solder resist

Lötstopplack

6 (0.236)

1.2 (0.047)

Hole on PCB

2.8 (0.110)

2.4 (0.094)

유사한 부품 번호 - LA-T776

제조업체	부품명	데이터시트	상세설명
OSRAM GmbH	LA-T776	201Kb / 15P	white SMT package

제조업체	부품명	데이터시트	상세설명
OSRAM GmbH	LSGT677	392Kb / 15P	white SMT package, colorless clear resin
	LSM47K	456Kb / 19P	white SMT package, colorless clear resin
	CT-DELSS1.12	694Kb / 22P	white SMT package, colorless clear resin
	LB-Y8SG	1Mb / 22P	white SMT package, colorless clear resin
	LB-A676	386Kb / 15P	white SMT package, colorless clear resin
	LP-M676	502Kb / 20P	white SMT package, colorless clear resin
	LS-P47F	522Kb / 21P	white SMT package, colorless clear resin
	LT-Y8SG	536Kb / 21P	white SMT package, colorless clear resin
	LG-M670	478Kb / 19P	white SMT package, colorless clear resin
	LB-M47C	415Kb / 15P	white SMT package, colorless clear resin
	LO-A67B	437Kb / 19P	white SMT package, colorless clear resin