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SI8415DB 데이터시트(PDF) 6 Page - Vishay Siliconix |
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SI8415DB 데이터시트(HTML) 6 Page - Vishay Siliconix |
6 / 6 page Si8415DB Vishay Siliconix New Product www.vishay.com 6 Document Number: 73210 S-50037—Rev. A, 17-Jan-05 PACKAGE OUTLINE MICRO FOOT: 4-BUMP (2 X 2, 0.8-mm PITCH) NOTES (Unless Otherwise Specified): 1. Laser mark on the silicon die back, coated with a thin metal. 2. Bumps are Eutectic solder 63/57 Sn/Pb. 3. Non-solder mask defined copper landing pad. 4. The flat side of wafers is oriented at the bottom. Bump Note 2 8415 XXX Recommended Land Mark on Backside of Die Silicon 4 O 0.30 X 0.31 Note 3 Solder Mask O X 0.40 b Diamerter e e A A2 A1 e S D e S E MILLIMETERS* INCHES Dim Min Max Min Max A 0.600 0.650 0.0236 0.0256 A1 0.260 0.290 0.0102 0.0114 A2 0.340 0.360 0.0134 0.0142 b 0.370 0.410 0.0146 0.0161 D 1.520 1.600 0.0598 0.0630 E 1.520 1.600 0.0598 0.0630 e 0.750 0.850 0.0295 0.0335 S 0.370 0.380 0.0146 0.0150 * Use millimeters as the primary measurement. Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?73210. |
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