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TC1302BIPVUATR 데이터시트(PDF) 3 Page - Microchip Technology

부품명 TC1302BIPVUATR
상세설명  LOW QUIESCENT CURRENT DUAL OUTPUT LDO
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제조업체  MICROCHIP [Microchip Technology]
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TC1302BIPVUATR 데이터시트(HTML) 3 Page - Microchip Technology

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© 2005 Microchip Technology Inc.
DS21333B-page 3
TC1302A/B
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD...................................................................................6.5V
Maximum Voltage on Any Pin ...... (VSS – 0.3) to (VIN + 0.3)V
Power Dissipation ..........................Internally Limited (Note 7)
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature, TJ ........................... +150°C
Continuous Operating Temperature Range ..-40°C to +125°C
ESD protection on all pins, HBM, MM
..................... 4 kV, 400V
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = VR +1V, IOUT1 = IOUT2 = 100 µA, CIN = 4.7 µF,
COUT1 = COUT2 = 1 µF, CBYPASS = 10 nF, SHDN > VIH, TA = +25°C.
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Operating Voltage
VIN
2.7
6.0
V
Note 1
Maximum Output Current
IOUT1Max
300
——
mA
VIN = 2.7V to 6.0V (Note 1)
Maximum Output Current
IOUT2Max
150
——
mA
VIN = 2.7V to 6.0V (Note 1)
Output Voltage Tolerance
(VOUT1 and VOUT2)
VOUT
VR – 2.5 VR±0.5 VR + 2.5
%
Note 2
Temperature Coefficient
(VOUT1 and VOUT2)
TCVOUT
25
ppm/°C
Note 3
Line Regulation
(VOUT1 and VOUT2)
ΔVOUT/ΔVIN
—0.02
0.2
%/V
(VR + 1V) ≤ VIN ≤ 6V
Load Regulation, VOUT ≥ 2.5V
(VOUT1 and VOUT2)
ΔVOUT/
VOUT
-1
0.1
+1
%IOUTX = 0.1 mA to IOUTMax, (Note 4)
Load Regulation, VOUT < 2.5V
(VOUT1 and VOUT2)
ΔVOUT/
VOUT
-1.5
0.1
+1.5
%IOUTX = 0.1 mA to IOUTMax, (Note 4)
Thermal Regulation
ΔVOUT/ΔPD
—0.04
%/W
Note 5
Dropout Voltage (Note 6)
VOUT1 > 2.7V
VIN – VOUT
104
180
mV
IOUT1 = 300 mA
VOUT2 > 2.6V
VIN – VOUT
150
250
mV
IOUT2 = 150 mA
Supply Current
TC1302A
IIN(A)
103
180
µA
SHDN2 = VIN, IOUT1 = IOUT2 = 0 mA
TC1302B
IIN(B)
—114
180
µA
SHDN1 = SHDN2 = VIN,
IOUT1 = IOUT2 = 0 mA
Note
1:
The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VR + VDROPOUT.
2:
VR is defined as the higher of the two regulator nominal output voltages (VOUT1 or VOUT2).
3:
TCVOUT = ((VOUTmax - VOUTmin) * 10
6)/(V
OUT * ΔT).
4:
Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5:
Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec.
6:
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
value measured at a 1V differential.
7:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.


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