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74LCX07MTC 데이터시트(HTML) 2 Page - ON Semiconductor

부품명 74LCX07MTC
상세내용  Low Voltage Hex Buffer with Open Drain Outputs
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74LCX07MTC 데이터시트(HTML) 2 Page - ON Semiconductor

 
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©1999 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LCX07 Rev. 1.11.1
74LCX07
Low Voltage Hex Buffer with Open Drain Outputs
Features
5V tolerant inputs
2.3V to 5.5V VCC specifications provided
2.9ns tPD max. (VCC = 3.3V), 10µA ICC max.
Power down high impedance inputs and outputs
+24mA output drive (VCC = 3.0V)
Latch-up performance exceeds JEDEC 78 conditions
ESD performance:
– Human body model > 2000V
– Machine model > 200V
Leadless DQFN package
General Description
The LCX07 contains six buffers. The inputs tolerate volt-
ages up to 7V allowing the interface of 5V systems to 3V
systems.
The outputs of the LCX07 are open drain and can be
connected to other open drain outputs to implement
active HIGH wire AND or active LOW wire OR functions.
The 74LCX07 is fabricated with advanced CMOS tech-
nology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Ordering Information
Note:
1. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number
Package Description
74LCX07M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX07SJ
M14D
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX07BQX(1)
MLP14A
14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 3.0mm
74LCX07MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Implements proprietary noise/EMI reduction circuitry
December 2013


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