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255D ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 5 Page - Vishay Siliconix

๋ถ€ํ’ˆ๋ช… 255D
์ƒ์„ธ๋‚ด์šฉ  Organic Polymer, Low ESR, Tantalum Capacitors Commercial, Surface Mount Capacitors for Switch Mode Power Supplies and Converters
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255D ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 5 Page - Vishay Siliconix

   
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Document Number: 40052
Revision 04-Feb-03
www.vishay.com
6
Type 255D
Vishay Sprague
4.
Recommended rated working voltage guidelines:
5.
Printed Circuit Board Materials:
The 255D is
compatible with commonly used printed circuit board
materials (alumina substrates, FR4, FR5, G10, PTFE-
fluorocarbon and porcelainized steel).
6.
Attachment:
6.1
Solder Paste: The recommended thickness of the
solder paste after application is .007"
ยฑ .001" [.178mm
ยฑ 0.025mm]. Care should be exercised in selecting
the solder paste. The metal purity should be high as
practical. The flux (in the paste) must be active enough
to remove the oxides formed on the metallization prior
to the exposure to soldering heat. In practice this can
be aided by extending the solder preheat time at
temperatures below the liquidous of the solder.
6.2
Soldering:
Capacitors can be attached by
conventional soldering techniques - vapor phase,
infrared reflow, wave soldering and hot plate methods.
The Soldering Profile chart shows maximum
recommended mended time/temperature conditions for
soldering. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. If hand soldering
is necessary, the soldering iron must never come in
contact with the capacitor.
APPLICATION VOLTAGE
RECOMMENDED
(V)
CAPACITOR VOLTAGE
RATING (V)
2.5
4.0
4.0
6.3
6.0
10.0
9.
Cleaning (Flux Removal) After Soldering: The 255D
is compatible with all commonly used solvents such as
TES, TMS, Prelete, Chlorethane, Terpene and aqueous
cleaning media. However, CFC/ODS products are not
used in the production of these devices and are not
recommended. Solvents containing methylene chloride
or other epoxy solvents should be avoided since these
will attack the epoxy encapsulation material.
9.1
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence-
of the termination. DO NOT EXCEED 9W/L @ 40kHz
for 2 minutes.
8.
Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to minimize
component rework due to unacceptable solder joints.
The dimensional configurations shown are the
recommended pad geometries for both wave and reflow
soldering techniques. These dimensions are intended
to be a starting point for circuit board designers and
may be fine tuned if necessary based upon the
peculiarities of the soldering process and/or circuit
board design.
REFLOW SOLDER PADS*
in inches [millimeters)
Case
Code
D
Separation
(C)
Pad
Metallization
(B)
Width
(A)
.118
[3.0]
.175
[4.45]
.106
[2.70]
Time (Seconds)
300
250
200
150
100
50
0
300
250
200
150
100
50
0
240
ยฐC Typical
130
ยฐC Typical
0
50
100
150
200
250
D
B
E
C
A
REFLOW SOLDERING PROFILE
GUIDE TO APPLICATION


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