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255D ๋ฐ์ดํฐ์ํธ(HTML) 5 Page - Vishay Siliconix |
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255D ๋ฐ์ดํฐ์ํธ(HTML) 5 Page - Vishay Siliconix |
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Document Number: 40052 Revision 04-Feb-03 www.vishay.com 6 Type 255D Vishay Sprague 4. Recommended rated working voltage guidelines: 5. Printed Circuit Board Materials: The 255D is compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE- fluorocarbon and porcelainized steel). 6. Attachment: 6.1 Solder Paste: The recommended thickness of the solder paste after application is .007" ยฑ .001" [.178mm ยฑ 0.025mm]. Care should be exercised in selecting the solder paste. The metal purity should be high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous of the solder. 6.2 Soldering: Capacitors can be attached by conventional soldering techniques - vapor phase, infrared reflow, wave soldering and hot plate methods. The Soldering Profile chart shows maximum recommended mended time/temperature conditions for soldering. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. If hand soldering is necessary, the soldering iron must never come in contact with the capacitor. APPLICATION VOLTAGE RECOMMENDED (V) CAPACITOR VOLTAGE RATING (V) 2.5 4.0 4.0 6.3 6.0 10.0 9. Cleaning (Flux Removal) After Soldering: The 255D is compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 9.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence- of the termination. DO NOT EXCEED 9W/L @ 40kHz for 2 minutes. 8. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design. REFLOW SOLDER PADS* in inches [millimeters) Case Code D Separation (C) Pad Metallization (B) Width (A) .118 [3.0] .175 [4.45] .106 [2.70] Time (Seconds) 300 250 200 150 100 50 0 300 250 200 150 100 50 0 240 ยฐC Typical 130 ยฐC Typical 0 50 100 150 200 250 D B E C A REFLOW SOLDERING PROFILE GUIDE TO APPLICATION |
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