TDA7266D

6/13

Figure 3. Stand-alone low-cost Application

PCB Layout and External Components:

Regarding the PCB layout care must be taken for three main subjects:

c) Signal and Power Gnd separation

d) Dissipating Copper Area

e) Filter Capacitors positioning

)Signal and Power Gnd separation:

c To the Signal GND must be referred the Audio Input Signals, the Mute and Stand-by Voltages and

the device PIN.13. This Gnd path must be as clean as possible in order to improve the device

THD+Noise and to avoid spurious oscillations across the speakers.

The Power GND is directly connected to the Output power Stage transistors (Emitters) and is crossed

by large amount of current, this path is also used in this device to dissipate the heating generated (no

needs of external heatsinker).

Referring to the typical application circuit, the separation between the two GND paths must be ob-

tained connecting them separately (star routing) to the bulk

Electrolithic capacitor C1 (470

µF).

Regarding the Power Gnd dimensioning we have to consider the Dissipated Power the Thermal Pro-

tection Threshold and the Package thermal Characteristics.

2

5

7

Vref

ST-BY

9

IN1

C3 0.22

µF

VCC

15

6

D02AU1410

+

-

-

+

OUT1+

OUT1-

19

16

14

MUTE

8

IN2

C5 0.22

µF

+

-

-

+

OUT2+

OUT2-

20

13

S-GND

PW-GND

C1

470

µF

C2

100nF

C7

100nF

R1

47K

C4

10

µF

R2

47K

1

10

11