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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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HCPL-7510-500 데이터시트(PDF) 4 Page - Agilent(Hewlett-Packard) |
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HCPL-7510-500 데이터시트(HTML) 4 Page - Agilent(Hewlett-Packard) |
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4 / 16 page  4 Solder Reflow Temperature Profile Recommended Pb-Free IR Profile 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160˚C 140˚C 150˚C PEAK TEMP. 245˚C PEAK TEMP. 240˚C PEAK TEMP. 230˚C SOLDERING TIME 200˚C PREHEATING TIME 150˚C, 90 + 30 SEC. 2.5˚C ± 0.5˚C/SEC. 3˚C + 1˚C/–0.5˚C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC. REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC. 217 ˚C RAMP-DOWN 6 ˚C/SEC. MAX. RAMP-UP 3 ˚C/SEC. MAX. 150 - 200 ˚C 260 +0/-5 ˚C t 25 ˚C to PEAK 60 to 150 SEC. 20-40 SEC. TIME WITHIN 5 ˚C of ACTUAL PEAK TEMPERATURE tp ts PREHEAT 60 to 180 SEC. tL TL Tsmax Tsmin 25 Tp TIME (SECONDS) NOTES: THE TIME FROM 25 ˚C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 ˚C, Tsmin = 150 ˚C |
유사한 부품 번호 - HCPL-7510-500 |
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유사한 설명 - HCPL-7510-500 |
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