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HT15G100J500CT 데이터시트(HTML) 7 Page - WALSIN TECHNOLOGY CORPORATION

부품명 HT15G100J500CT
상세내용  Halogen Free & RoHS Compliance
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제조사  WALSIN [WALSIN TECHNOLOGY CORPORATION]
홈페이지  http://www.passivecomponent.com/
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HT15G100J500CT 데이터시트(HTML) 7 Page - WALSIN TECHNOLOGY CORPORATION

 
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Multilayer Ceramic Capacitors
Approval Sheet
Page 7 of 11
ASC_High Temperature Cap_(HT)_026B_AS
Dec. 2018
9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item
Test Condition
Requirements
1. Visual and
Mechanical
---
* No remarkable defect.
* Dimensions to conform to individual specification sheet.
2. Capacitance
* Class I: (X8G)
Cap
≤1000pF, 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
* Class II: (X8R)
1.0±0.2Vrms, 1kHz±10%
* Before initial measurement (Class II only): To apply de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
* Shall not exceed the limits given in the detailed spec.
3. Q/ D.F.
(Dissipation
Factor)
* X8G: Cap
≥30pF, Q≥1000; Cap<30pF, Q≥400+20C
* X8R: D.F.
≤5%
4. Dielectric
Strength
* To apply voltage (
≤100V) 250%.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
5. Insulation
Resistance
* To apply rated voltage for MAX. 120sec.
* 10G
or RxC
≥500 -F whichever is smaller
6. Temperature
Coefficient
* With no electrical load.
T.C.
Operating Temp
X8G
-55~150°C at 25°C
X8R
-55~150°C at 25°C
* Before initial measurement (Class II only):
To apply de-aging at 150°C for 1hr then set for 24± 2 hrs at
room temp.
T.C.
Capacitance Change
X8G
Within ±30ppm/°C
X8R
Within ±15%
7. Adhesive
Strength of
Termination
* Pressurizing force:
5N (
≤0603) and 10N (>0603)
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8. Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Before initial measurement (Class II only):
To apply de-aging at 150°C for 1hr then set for 24± 2 hrs at
room temp.
* Cap./DF(Q) Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9. Solderability
* Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10. Bending Test
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Before initial measurement (Class II only):
To apply de-aging at 150°C for 1hr then set for 24± 2 hrs at
room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change:
X8G: within ±5.0% or ±0.5pF whichever is larger.
X8R: within ±12.5%
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
11. Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before imme rse the
capacitor in a eutectic solder.
* Before initial measurement (Class II only): To apply de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging
at 150°C for 1hr then set for 24±2 hrs at room temp .
* No remarkable damage.
* Cap change:
X8G: within ±2.5% or ±0.25pF whichever is larger.
X8R: within ±7.5%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.


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