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MC100EP809 데이터시트(PDF) 7 Page - ON Semiconductor

부품명 MC100EP809
상세설명  3.3V 1:9 Differential HSTL/PECL to HSTL Clock Driver with LVTTL Clock Select and Enable
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100EP809 데이터시트(HTML) 7 Page - ON Semiconductor

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MC100EP809
http://onsemi.com
7
PACKAGE DIMENSIONS
LQFP
FA SUFFIX
32–LEAD PLASTIC PACKAGE
CASE 873A–02
ISSUE A
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
N
J
D
F
METAL
SECTION AE–AE
G
SEATING
PLANE
R
Q
_
W
K
X
E
C
H
DETAIL AD
DETAIL AD
A1
B1
V1
4X
S
4X
9
–T–
–Z–
–U–
T-U
0.20 (0.008)
Z
AC
T-U
0.20 (0.008)
Z
AB
0.10 (0.004) AC
–AC–
–AB–
M
_
8X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS -T-, -U-, AND -Z- TO BE
DETERMINED AT DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL
BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
A
MIN
MAX
MIN
MAX
INCHES
7.000 BSC
0.276 BSC
MILLIMETERS
B
7.000 BSC
0.276 BSC
C
1.400
1.600
0.055
0.063
D
0.300
0.450
0.012
0.018
E
1.350
1.450
0.053
0.057
F
0.300
0.400
0.012
0.016
G
0.800 BSC
0.031 BSC
H
0.050
0.150
0.002
0.006
J
0.090
0.200
0.004
0.008
K
0.500
0.700
0.020
0.028
M
12 REF
12 REF
N
0.090
0.160
0.004
0.006
P
0.400 BSC
0.016 BSC
Q
1
5
1
5
R
0.150
0.250
0.006
0.010
V
9.000 BSC
0.354 BSC
V1
4.500 BSC
0.177 BSC
__
__
_
_
B1
3.500 BSC
0.138 BSC
A1
3.500 BSC
0.138 BSC
S
9.000 BSC
0.354 BSC
S1
4.500 BSC
0.177 BSC
W
0.200 REF
0.008 REF
X
1.000 REF
0.039 REF


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