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FP1008R4 데이터시트(PDF) 5 Page - Eaton All Rights Reserved. |
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FP1008R4 데이터시트(HTML) 5 Page - Eaton All Rights Reserved. |
5 / 5 page Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2016 Eaton All Rights Reserved Printed in USA Publication No. 10499 BU-MC16135 November 2016 Eaton is a registered trademark. All other trademarks are property of their respective owners. Technical Data 10499 Effective November 2016 FP1008R4 High frequency, high current power inductors Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100 °C 150 °C • Temperature max. (Tsmax) 150 °C 200 °C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3 °C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183 °C 60-150 Seconds 217 °C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6 °C/ Second Max. 6 °C/ Second Max. Time 25 °C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 <2.5mm) 235 °C 220 °C ≥2.5mm 220 °C 220 °C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260 °C 260 °C 260 °C 1.6 – 2.5mm 260 °C 250 °C 245 °C >2.5mm 250 °C 245 °C 245 °C |
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