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AM42BDS640AG 데이터시트(PDF) 71 Page - SPANSION

부품명 AM42BDS640AG
부품 상세설명  Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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AM42BDS640AG 데이터시트(HTML) 71 Page - SPANSION

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Am42BDS640AG
November 1, 2002
P R E L I M INARY
PHYSICAL DIMENSIONS
FSC093—93-Ball Fine-Pitch Grid Array 8 x 11.6 mm
3187\38.14A
N/A
8.00 mm x 11.60 mm
PACKAGE
FSC 093
NOM.
---
---
---
1.40
---
1.10
MAX.
8.00 BSC.
11.60 BSC.
12
---
MIN.
1.00
0.25
8.80 BSC.
7.20 BSC.
10
93
0.35
0.40
0.40 BSC
A2,A3,A4,A5,A6,A7,A8,A9
C10,D1,D10,E1,E10,H1,H10
J1,J10,K1,K10
M2,M3,M4,M5,M6,M7,M8,M9
0.30
0.80 BSC
ME
D
JEDEC
PACKAGE
SYMBOL
A
A2
A1
MD
D1
E
E1
n
NOTE
DEPOPULATED SOLDER BALL
MATRIX SIZE E DIRECTION
MATRIX FOOTPRINT
BALL PITCH
0.80 BSC
BALL PITCH
SOLDER BALL PLACEMENT
BODY SIZE
BALL HEIGHT
BODY SIZE
BODY THICKNESS
PROFILE
BALL DIAMETER
MATRIX SIZE D DIRECTION
BALL COUNT
MATRIX FOOTPRINT
eE
eD
SD/SE
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTION OR OTHER MEANS.
b
O
93X
6
b
0.20 C
C
C
SIDE VIEW
A2
A1
A
0.08
0.15 M C
MC
AB
0.08
10
INDEX MARK
C
0.15
(2X)
(2X)
C
0.15
B
A
D
E
PIN A1
TOP VIEW
CORNER
L
M
eD
CORNER
E1
7
SE
D1
A
B
DC
E
F
HG
10
8
9
7
5
6
4
2
3
J
K
1
eE
SD
BOTTOM VIEW
PIN A1
7


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