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CL10B103KB8NNNC 데이터시트(PDF) 31 Page - Samsung semiconductor

부품명 CL10B103KB8NNNC
상세설명  Multi-layer Ceramic Capacitor
Download  36 Pages
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제조업체  SAMSUNG [Samsung semiconductor]
홈페이지  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

CL10B103KB8NNNC 데이터시트(HTML) 31 Page - Samsung semiconductor

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MLCC Product Manual
5. Design
5-1. Circuit design
When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the
drop in insulation resistance. Therefore, it is required to install safety equipment such as a fuse to
prevent additional accidents when MLCC is short-circuited, otherwise, electric short and fire may
occur. This product is not a safety guaranteed product..
5-2. PCB Design
5-2-1. Unlike lead type components, SMD type components that are designed to be mounted directly
on the board are fragile to the stress. In addition, they are more sensitive to mechanical and
thermal stress than lead type components.
5-2-2. MLCC crack by PCB material type
A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal
expansion and contraction, resulting in cracks in MLCC. Even though MLCC is mounted on a
board with a fluorine resin or on a single-layered glass epoxy, cracks in MLCC may occur.
5-3. Design system evaluation
5-3-1. Evaluate the actual design with MLCC to make sure there is no functional issue or violation of
specifications of the finished goods.
5-3-2. Please note that the capacitance may differ based on the operating condition of the actual system
since Class 2 MLCC capacitance varies with applied voltage and temperature.
5-3-3. Surge resistance must be evaluated since the excessive surge caused by the inductance of the
actual system may apply to MLCC.
5-3-4. Note the actual MLCC size and the termination shape.
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