MC74VHCU04

VHC Data – Advanced CMOS Logic

DL203 — Rev 0

5

MOTOROLA

OUTLINE DIMENSIONS

M SUFFIX

PLASTIC SOIC EIAJ PACKAGE

CASE 965–01

ISSUE O

HE

A1

DIM

MIN

MAX

MIN

MAX

INCHES

–––

2.05

–––

0.081

MILLIMETERS

0.05

0.20

0.002

0.008

0.35

0.50

0.014

0.020

0.18

0.27

0.007

0.011

9.90

10.50

0.390

0.413

5.10

5.45

0.201

0.215

1.27 BSC

0.050 BSC

7.40

8.20

0.291

0.323

0.50

0.85

0.020

0.033

1.10

1.50

0.043

0.059

0

0.70

0.90

0.028

0.035

–––

1.42

–––

0.056

A1

HE

Q1

LE

0

LE

Q1

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

0.10 (0.004)

D

Z

E

1

14

8

7

e

A

b

VIEW P

c

L

DETAIL P

M

A

b

c

D

E

e

0.50

M

Z

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MC74VHCU04/D

◊

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