전자부품 데이터시트 검색엔진 |
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BQ25171-Q1 데이터시트(PDF) 8 Page - Texas Instruments |
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BQ25171-Q1 데이터시트(HTML) 8 Page - Texas Instruments |
8 / 11 page 5.3 Mechanical A A www.ti.com PACKAGE OUTLINE C 10X 0.3 0.2 2.4 0.1 2X 2 1.65 0.1 8X 0.5 1.0 0.8 10X 0.5 0.3 0.05 0.00 A 3.1 2.9 B 3.1 2.9 (0.2) TYP 0.1 MIN (0.13) 4X (0.25) 2X (0.5) (0.16) TYP VSON - 1 mm max height DRC0010U PLASTIC SMALL OUTLINE - NO LEAD 4225163/A 07/2019 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 5 6 10 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED SYMM SYMM 11 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. SCALE 4.000 SCALE 30.000 SECTION A-A SECTION A-A TYPICAL BQ25171-Q1 SLUSDK1 – AUGUST 2020 www.ti.com 8 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: BQ25171-Q1 |
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