5.3 Mechanical

A

A

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PACKAGE OUTLINE

C

10X

0.3

0.2

2.4 0.1

2X

2

1.65 0.1

8X 0.5

1.0

0.8

10X

0.5

0.3

0.05

0.00

A

3.1

2.9

B

3.1

2.9

(0.2) TYP

0.1 MIN

(0.13)

4X (0.25)

2X (0.5)

(0.16) TYP

VSON - 1 mm max height

DRC0010U

PLASTIC SMALL OUTLINE - NO LEAD

4225163/A 07/2019

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

5

6

10

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

SYMM

SYMM

11

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

SCALE 4.000

SCALE 30.000

SECTION A-A

SECTION A-A

TYPICAL

BQ25171-Q1

SLUSDK1 – AUGUST 2020

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8

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