전자부품 데이터시트 검색엔진 |
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TMS320F280049 데이터시트(PDF) 64 Page - Texas Instruments |
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TMS320F280049 데이터시트(HTML) 64 Page - Texas Instruments |
64 / 231 page 64 TMS320F280049, TMS320F280049C TMS320F280048, TMS320F280048C, TMS320F280045 TMS320F280041, TMS320F280041C, TMS320F280040, TMS320F280040C SPRS945E – JANUARY 2017 – REVISED APRIL 2020 www.ti.com Submit Documentation Feedback Product Folder Links: TMS320F280049 TMS320F280049C TMS320F280048 TMS320F280048C TMS320F280045 TMS320F280041 TMS320F280041C TMS320F280040 TMS320F280040C Specifications Copyright © 2017–2020, Texas Instruments Incorporated (1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (2) lfm = linear feet per minute 5.7.3 RSH Package °C/W(1) AIR FLOW (lfm)(2) RΘJC Junction-to-case thermal resistance 11.9 N/A RΘJB Junction-to-board thermal resistance 3.3 N/A RΘJA (High k PCB) Junction-to-free air thermal resistance 25.8 0 RΘJMA Junction-to-moving air thermal resistance 17.4 150 15.1 250 13.4 500 PsiJT Junction-to-package top 0.2 0 0.3 150 0.4 250 0.4 500 PsiJB Junction-to-board 3.3 0 3.2 150 3.2 250 3.2 500 RΘJC, bottom Junction-to-bottom case thermal resistance 0.7 0 5.8 Thermal Design Considerations Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems that exceed the recommended maximum power dissipation in the end product may require additional thermal enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and definitions. |
유사한 부품 번호 - TMS320F280049_V02 |
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유사한 설명 - TMS320F280049_V02 |
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