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TMS320F280049 데이터시트(PDF) 64 Page - Texas Instruments

부품명 TMS320F280049
상세설명  TMS320F28004x Microcontrollers
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홈페이지  http://www.ti.com
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TMS320F280049 데이터시트(HTML) 64 Page - Texas Instruments

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TMS320F280049, TMS320F280049C
TMS320F280048, TMS320F280048C, TMS320F280045
TMS320F280041, TMS320F280041C, TMS320F280040, TMS320F280040C
SPRS945E – JANUARY 2017 – REVISED APRIL 2020
www.ti.com
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Product Folder Links: TMS320F280049 TMS320F280049C TMS320F280048 TMS320F280048C TMS320F280045
TMS320F280041 TMS320F280041C TMS320F280040 TMS320F280040C
Specifications
Copyright © 2017–2020, Texas Instruments Incorporated
(1)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2)
lfm = linear feet per minute
5.7.3
RSH Package
°C/W(1)
AIR FLOW (lfm)(2)
JC
Junction-to-case thermal resistance
11.9
N/A
JB
Junction-to-board thermal resistance
3.3
N/A
JA (High k PCB)
Junction-to-free air thermal resistance
25.8
0
JMA
Junction-to-moving air thermal resistance
17.4
150
15.1
250
13.4
500
PsiJT
Junction-to-package top
0.2
0
0.3
150
0.4
250
0.4
500
PsiJB
Junction-to-board
3.3
0
3.2
150
3.2
250
3.2
500
JC, bottom
Junction-to-bottom case thermal resistance
0.7
0
5.8
Thermal Design Considerations
Based on the end application design and operational profile, the IDD and IDDIO currents could vary.
Systems that exceed the recommended maximum power dissipation in the end product may require
additional thermal enhancements. Ambient temperature (TA) varies with the end application and product
design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the
ambient temperature. Hence, care should be taken to keep TJ within the specified limits. Tcase should be
measured to estimate the operating junction temperature TJ. Tcase is normally measured at the center of
the package top-side surface. The thermal application report Semiconductor and IC Package Thermal
Metrics helps to understand the thermal metrics and definitions.


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