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BD9P1X5EFV-C 데이터시트(PDF) 9 Page - Rohm |
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BD9P1X5EFV-C 데이터시트(HTML) 9 Page - Rohm |
9 / 60 page 9/57 TSZ02201-0J1J0AL01480-1-2 © 2019 ROHM Co., Ltd. All rights reserved. 08.Apr.2020 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9P1x5EFV-C Series Absolute Maximum Ratings Parameter Symbol Rating Unit Input Voltage VVIN, VPVIN -0.3 to +42 V EN Voltage VEN -0.3 to +42 V BST Voltage VBST -0.3 to +49 V Voltage from SW to BST ΔVBST VSW -0.3 to VSW +7 V FB, RESET, MODE, SSCG, OCP_SEL Voltage VFB, VRESET, VMODE, VSSCG VOCP_SEL -0.3 to +7 V VOUT_DIS Voltage VVOUT_DIS -0.3 to +10 V VOUT_SNS Voltage VVOUT_SNS -0.3 to +10 V VCC_EX Voltage VVCC_EX -0.3 to +7 V VREG Voltage VREG -0.3 to +7 V Storage Temperature Range Tstg -55 to +150 ˚C Maximum Junction Temperature Tjmax 150 ˚C Human Body Model (HBM) (Note 1) VESD_HBM ±2 kV Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) These voltages are guaranteed by design. Not tested. Thermal Resistance (Note 2) Parameter Symbol Thermal Resistance (Typ) Unit 1s (Note 4) 2s2p (Note 5) HTSSOP-B20 Junction to Ambient θJA 143.0 26.8 °C/W Junction to Top Characterization Parameter (Note 3) ΨJT 8 4 °C/W (Note 2) Based on JESD51-2A(Still-Air). (Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 4) Using a PCB board based on JESD51-3. (Note 5) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size Thermal Via (Note 6) Pitch Diameter 4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt 1.20 mm Φ0.30 mm Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 6) This thermal via connects with the copper pattern of all layers. |
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