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BD9P1X5EFV-C 데이터시트(PDF) 27 Page - Rohm |
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BD9P1X5EFV-C 데이터시트(HTML) 27 Page - Rohm |
27 / 60 page 27/57 TSZ02201-0J1J0AL01480-1-2 © 2019 ROHM Co., Ltd. All rights reserved. 08.Apr.2020 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9P1x5EFV-C Series Protect Function - continued 4. Thermal Shutdown (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. If junction temperature (Tj) exceeds TSD detection temperature (175 °C, Typ), the POWER MOSFETs are turned off. When the Tj falls below the TSD temperature (150 °C, Typ), the IC restarts up with soft start. Where the input voltage required for the restart is the same as that for the initial startup (Input voltage 4.0 V or more). Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. VIN VEN VREG Tj VOUT TSD Detect 175 °C (Typ) TSD Release 150 °C (Typ) VUVLO_R tDLY 2.95 V (Typ) tRSTNACT 3.6 ms (Typ) 400 µs (Typ) VRTH VRESET Figure 43. TSD Timing Chart |
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