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BM63573S-VA 데이터시트(PDF) 12 Page - Rohm

부품명 BM63573S-VA
부품 상세설명  600V IGBT Intelligent Power Module (IPM)
Download  23 Pages
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제조업체  ROHM [Rohm]
홈페이지  http://www.rohm.com
Logo ROHM - Rohm

BM63573S-VA 데이터시트(HTML) 12 Page - Rohm

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BM63573S-VA
BM63573S-VC
TSQ50501-BM63573S-2
© 2020 ROHM Co., Ltd. All rights reserved.
30.Jul.2020 Rev.001
www.rohm.com
TSZ22111・15・001
Selection of Components Externally Connected (Refer to Figure 14)
1) VBU, VBV, VBW pin
・The bypass capacitor(good temperature, frequency characteristic electrolytic type C1: 22µF to 100µF) should be mounted
as close as possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply
ripple. In addition, for the purpose of reducing of the
power supply’s impedance in wide frequency bandwidth, ceramic
capacitor (good temperature, frequency and DC bias characteristic ceramic type C2: 0.1µF to 0.22µF) should also be
mounted.
・Zenner diode D1(1W) should be mounted between each pair of control supply pins to prevent surge destruction.
・Line ripple voltage should meet dV/dt
≤1V/µs, Vripple ≤ 2Vp-p.
・The wiring from U, V, W pin should be as thick and as short as possible. They should be connected directly and separated
from the main output wires.
2) HVCC, LVCC pin
・The bypass capacitor(good temperature, frequency characteristic electrolytic type C3) should be mounted as close as
possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply ripple. In
addition, for the purpose of reducing of the
power supply’s impedance in wide frequency bandwidth, ceramic capacitor
(good temperature, frequency and DC bias characteristic ceramic type C2: 0.1µF to 0.22µF) should also be mounted.
・Zenner diode D1(1W) should be mounted between each pair of control supply pins to prevent surge destruction.
・Line ripple voltage should meet dV/dt
≤ 1V/µs, Vripple ≤ 2Vp-p.
3) P pin
・To prevent surge destruction, the wiring between the smoothing capacitor and P, N pins should be as short as possible.
・Snubber capacitor(C4: 0.1µF to 0.22µF) should be mounted between the P-N pin.
4) Control Input pin (HINU, HINV, HINW, LINU, LINV, LINW)
・The wiring should be as short as possible to prevent malfunction.
・Input drive is active-high type. There is a 3.3k
Ω(Min) pull-down resistor in the input circuit of IPM. When using RC coupling
circuit, make sure the input signal level meet the input threshold voltage.
・Dead time of input signal should be more than specified value.
・The pull-down resistors in Control Input pins become effective when voltage supplied into LVCC and HVCC pins are in the
range of recommended operating condition. Control Input pins have high impedance when power supply to LVCC and
HVCC pins are off. When power supply to HVCC pin is off, the pull-down resistance of HINU, HINV, HINW pins is the
value written on Page 6.
5) FO pin
・FO output is open drain type. It should be pulled up to control power supply(e.g. 5V, 15V) by a resistor that makes IFO up
to 1mA.IFO is estimated roughly by the formula of control power supply voltage divided by pull-up resistance(R1). In the
case of pulled up to 5V, R1=10k
Ω is recommended.
6) CIN pin
・RC filter(R2, C5) should be mounted as close as possible to the pin in order to prevent malfunction by recovery current or
switching noise. It is recommended to select tight tolerance, temp-compensated type for RC filter (R2, C5).
The time constant R2C5 (1.0µs is recommended) should be set so that SCP current is shut down within 2µs.
Please confirm operation on the actual application since SCP shutdown time changes depending on the PCB wiring
pattern.
・The point D at which the wiring to CIN filter is divided should be near the pin of shunt resistor. NU, NV, NW pin should be
connected at near NU, NV, NW pin.
・To prevent malfunction, the wiring of B should be as short as possible.
7) VOT pin (Refer to Fugure 15)
・It is recommended to insert 5.1k
Ω pull down resistor for getting linear output characteristics at lower temperature than
room temperature. When the pull down resistor is inserted between VOT and GND (control GND), the extra current
calculated by VOT output voltage divided by pull down resistance flows as LVIC circuit current continuously. In the case
of only using VOT for detecting higher temperature than room temperature, it isn't necessary to insert the pull down
resistor.
・In the case of using VOT with low voltage controller (e.g. 3.3V MCU), VOT output might exceed control supply voltage
3.3V when temperature rises excessively. If system uses low voltage controller, it is recommended to insert a clamp
diode between control supply of the controller and VOT for preventing over voltage.
・In the case of using low voltage controller like 3.3V MCU, if it is necessary to set the trip VOT level to control supply
voltage (e.g. 3.3V) or more, there is the method of dividing the VOT output by resistance voltage divider circuit and then
inputting to A/D converter on MCU. In that case, sum of the resistances of divider circuit should be as much as 5k
Ω.
・When VOT pin is not used, please do not connect VOT pin to any other nodes.
・Please refer the application note for this product about the usage of VOT output.


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