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전자부품 데이터시트 검색엔진 |
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AM50DL128CG 데이터시트(HTML) 61 Page - SPANSION |
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AM50DL128CG 데이터시트(HTML) 61 Page - SPANSION |
61 / 63 page ![]() 60 Am50DL128CG November 7, 2002 P R E L I M I NARY PHYSICAL DIMENSIONS FTA088—88-Ball Fine-Pitch Grid Array 11.6 x 8 mm 3237 \ 16-038.14b PACKAGE FTA 088 JEDEC N/A 11.60 mm x 8.00 mm PACKAGE SYMBOL MIN NOM MAX NOTE A --- --- 1.40 PROFILE A1 0.25 --- --- BALL HEIGHT A2 1.00 --- 1.11 BODY THICKNESS D 11.60 BSC. BODY SIZE E 8.00 BSC. BODY SIZE D1 8.80 BSC. MATRIX FOOTPRINT E1 7.20 BSC. MATRIX FOOTPRINT MD 12 MATRIX SIZE D DIRECTION ME 10 MATRIX SIZE E DIRECTION n 88 BALL COUNT φb 0.30 0.35 0.40 BALL DIAMETER eE 0.80 BSC. BALL PITCH eD 0.80 BSC BALL PITCH SD / SE 0.40 BSC. SOLDER BALL PLACEMENT A3,A4,A5,A6,A7,A8,B1,B10,C1,C10,D1,D10 DEPOPULATED SOLDER BALLS E1,E10,F1,F10,G1,G10,H1,H10 J1,J10,K1,K10,L1,L10,M3,M4,M5,M6,M7,M8 NOTES: 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 9. N/A 10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. 10 INDEX MARK L M 88X eD CORNER C 0.15 (2X) (2X) C 0.15 E1 7 SE B A D1 A B DC E F HG 10 8 9 7 5 6 4 2 3 J K 1 eE SD BOTTOM VIEW 6 b 0.20 C C 0.15 0.08 MC MC AB PIN A1 7 D E PIN A1 C TOP VIEW SIDE VIEW CORNER A2 A1 A 0.08 |