TPA6030A4

SLOS395A – DECEMBER 2002 – REVISED JANUARY 2003

3W STEREO AUDIO POWER AMPLIFIER

WITH ADVANCED DC VOLUME CONTROL

FEATURES

Headphones (SE)

APPLICATIONS

DESCRIPTION

The TPA6030A4 is designed to drive 3 W into 16-

Ω

speakers using a surface-mount package without the need

for an external heatsink. These features make it ideal for

15

I–17I LCD monitors, small multimedia speakers, and

notebook computers.

To simplify system design, the speaker volume level is

adjusted by applying a dc voltage to the VOLUME

terminal. The delta between speaker volume and

headphone volume can be adjusted by applying a dc

voltage to the SEDIFF terminal. To avoid an unexpected

high volume level through the headphones, a third

terminal, SEMAX, limits the headphone volume level

when a dc voltage is applied. Integrated depop circuitry

and the fully differential design minimize pops, clicks, and

unwanted noise to provide a high level of audio

performance.

The device is available in a 28-pin TSSOP PowerPAD



package. The PowerPAD

 package is designed to

transfer heat into the ground plane, eliminating the need

for external heat sinks—minimizing solution cost and size.

From TV

From TV

From TV

From TV

VCC = 12V

System

Control

47 nF

From DAC or

Potentiometers

(DC Voltage)

Shutdown

PVcc

PVcc

R

Mux

R

Mux

L

Mux

L

Mux

Input Mux

Control

32–Step

Volume

Control

VCC/2

+

–

+

–

VCC/2

Power

Management

Vcc

Output Mode

System

Control

Gnd

5VREF

Rout +

Rout –

Lout +

Lout –

To Potentiometers

or DAC reference

Bypass

RIN1+

CLK

SEMAX

SEDIFF

VOLUME

SE/BTL

IN2/IN1

From CD

Player

From CD

Player

From CD

Player

From CD

Player

0.47

µF

220

µF

220

µF

16

Ω

16

Ω

1 k

Ω

1 k

Ω

Control

Depop

Circuitry

RIN2+

RIN1–

RIN2–

RIN1+

RIN2+

0.47

µF

RIN1–

RIN2–

1

µF

10

µF

100 k

Ω

FUNCTIONAL DIAGRAM

100 k

Ω

0.47

µF

0.47

µF

0.47

µF

0.47

µF

0.47

µF

0.47

µF

0.47

µF

PRODUCTION DATA information is current as of publication date. Products

conform to specifications per the terms of Texas Instruments standard warranty.

Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

semiconductor products and disclaimers thereto appears at the end of this data sheet.

www.ti.com

Copyright

 2003, Texas Instruments Incorporated

PowerPAD is a trademark of Texas Instruments.