5 / 6 page
CX5000:
0.18um Structured ASIC Product Family
© ChipX Inc.
5
CEC034 (9/20/05)
I/O Ring
As shown in Figure 3, the CX5000 I/O ring is comprised of blocks of 8 metal programmable I/O drivers,
16 pads and ESD structures.
Each I/O structure may be split into one simple
input (CMOS or TTL) and one simple output
(CMOS or TTL) to maximize the chip
’s signal I/O. In
cases where the cell is configured as a bi-
directional or an advanced single-ended I/O (e.g.,
PCI), the cell supports one signal only; the other
pad can be left unconnected or used for power.
Differential I/Os require two I/O structures per
channel and use two pads; the remaining two pads
are power or no-connect.
Supported I/O
As shown in Table 4, the CX5000 family supports 676 simple I/O macrocells in addition to a number of
advanced I/Os based on popular industry standards.
Customer
Core
PLL,
Vb & Vref
I/O
Driver
I/O
Driver
I/O
Driver
I/O
Driver
I/O
Driver
Output
Input
&
Output
Bidir
LVDS
LVDS#
VCC
GND
Figure 3. CX5000 I/O Structure
Korean ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
