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GS8182D18D-200 데이터시트(PDF) 1 Page - GSI Technology |
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GS8182D18D-200 데이터시트(HTML) 1 Page - GSI Technology |
1 / 27 page Preliminary GS8182D18D-250/200/167 18Mb Burst of 4 SigmaQuad-II SRAM 250 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O 165-Bump BGA Commercial Temp Industrial Temp Rev: 1.02 11/2004 1/27 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Features • Simultaneous Read and Write SigmaQuad™ Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface • Byte Write controls sampled at data-in time • Burst of 4 Read and Write • 1.8 V +150/–100 mV core power supply • 1.5 V or 1.8 V HSTL Interface • Pipelined read operation • Fully coherent read and write pipelines • ZQ mode pin for programmable output drive strength • IEEE 1149.1 JTAG-compliant Boundary Scan • 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices SigmaRAM™ Family Overview GS8182D18 are built in compliance with the SigmaQuad-II SRAM pinout standard for Separate I/O synchronous SRAMs. They are 18,874,368-bit (18Mb) SRAMs. These are the first in a family of wide, very low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems. Clocking and Addressing Schemes A Burst of 4 SigmaQuad-II SRAM is a synchronous device. It employs two input register clock inputs, K and K. K and K are independent single-ended clock inputs, not differential inputs to a single differential clock input buffer. The device also allows the user to manipulate the output register clock inputs quasi independently with the C and C clock inputs. C and C are also independent single-ended clock inputs, not differential inputs. If the C clocks are tied high, the K clocks are routed internally to fire the output registers instead. Because Separate I/O Burst of 4 RAMs always transfer data in four packets, A0 and A1 are internally set to 0 for the first read or write transfer, and automatically incremented by 1 for the next transfers. Because the LSBs are tied off internally, the address field of a Burst of 4 RAM is always two address pins less than the advertised index depth (e.g., the 1M x 18 has a 256K addressable index). Parameter Synopsis -250 -200 -167 tKHKH 4.0 ns 5.0 ns 6.0 ns tKHQV 0.45 ns 0.45 ns 0.50 ns 165-Bump, 13 mm x 15 mm BGA 1 mm Bump Pitch, 11 x 15 Bump Array Bottom View JEDEC Std. MO-216, Variation CAB-1 |
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