SN74AUC1G02

SINGLE 2INPUT POSITIVENOR GATE

SCES369M − SEPTEMBER 2001 − REVISED MAY 2005

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

I/O Tolerant to Support Mixed-Mode Signal

Operation

Operation

JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

3

2

4

5

1

Y

B

GND

DBV PACKAGE

(TOP VIEW)

YEA, YEP, YZA,

OR YZP PACKAGE

(BOTTOM VIEW)

DCK PACKAGE

(TOP VIEW)

3

2

4

5

1

Y

B

GND

3

2

4

5

1

A

Y

B

GND

A

GND

Y

B

DRL PACKAGE

(TOP VIEW)

See mechanical drawings for dimensions.

1

4

2

3

5

description /ordering information

The SN74AUC1G02 performs the Boolean function Y = A + B or Y = A

• B in positive logic.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE PART NUMBER

TOP-SIDE MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74AUC1G02YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Tape and reel

SN74AUC1G02YZAR

_ _ _UB_

−40

°C to 85°C

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Tape and reel

SN74AUC1G02YEPR

_ _ _UB_

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74AUC1G02YZPR

SOT (SOT-23) − DBV

Tape and reel

SN74AUC1G02DBVR

U02_

SOT (SC-70) − DCK

Tape and reel

SN74AUC1G02DCKR

UB_

SOT (SOT-553) − DRL

Reel of 4000

SN74AUC1G02DRLR

UB_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

Copyright

 2005, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

NanoStar and NanoFree are trademarks of Texas Instruments.