SLIDE SWITCHES (SMD)
CAS
s Specifications are subject to change without notice. Specifications in this catalog are for reference. The formal specification sheets will be submitted upon request.
COPAL ELECTRONICS
COPAL ELECTRONICS
s SOLDERING CONDITIONS
q Soldering iron
3 s maximum at 300 °C
q Vapor-phase soldering
215 °C, less than 35 s
q Infrared reflow soldering
The temperature profile shown at right is recommended for
reflow soldering. However, process carefully in case of
infrared heater, because the absoription rate of the
object may vary according to its color, material, etc. and
thus heating rate can be different. Please note that the
surface temperature of the product should not exceed
240 ˚C. When the product temperature exceeds 250 °C,
deformation may occur due to heat.
Tp
Tm
tm
Time
3~4 min
Tp
240
°C (Peak temperature)
Tm
180
°C (Melting point temperature)
tm
10 s
(Melting time)
<Taping packaging specifications>
q Taping version is packaged in 1000 pcs. per reel.
Orders will be accepted for units of 1000 pcs., i.e., 1000,
2000, 3000 pcs., etc.
q Taping version is boxed with two reels (2000 pcs.).
q Embossed tape dimensions
q Reel dimensions
(Unit: mm)
Empty
Filled
Empty
40 mm min.
20 pitches min.
400 mm min.
Direction of feed
Head
End
Leader
2
±0.5
16.4
22.4 max.
0
+2
13
±0.2
φ
21
±0.8
φ
Maximum number of consecutive missing pieces=2
Leader length and reel dimension are shown in the
diagrams below:
q Reel & embossed tape materials
Embossed tape: Plastic
Reel: Paper
q Embossed tape pull strength
10 N {1.02 kgf} minimum
q Peeling strength of seal tape
0.1~0.7 N {10.2~71.4 gf}
q Test method for peeling strength of seal tape
Seal cover tape
165
°~180°
Direction of feed
Carrier tape
Peel direction
(300 mm/min)
s PACKAGING SPECIFICATIONS
{ } : Reference only
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