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TISP4X00F3 데이터시트(PDF) 3 Page - Bourns Electronic Solutions |
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TISP4X00F3 데이터시트(HTML) 3 Page - Bourns Electronic Solutions |
3 / 11 page NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4600F3, TISP4700F3 Thermal Characteristics Parameter Test Conditions Min Typ Max Unit RθJA Junction to free air thermal resistance EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 °C, (see Note 3) 120 °C/W 265 mm x 210 mm populated line card, 4-layer PCB, IT = ITSM(1000), TA = 25 °C 57 NOTE 3: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths. Parameter Measurement Information Figure 1. Voltage-Current Characteristic for R-T Terminal Pair -v V DRM I DRM V D I H I TSM I TSP V (BO) I (BO) I D Quadrant I I Switching Characteristic +v +i V (BO) I (BO) V D I D I H I TSM I TSP -i Quadrant III Switching Characteristic PMXXAJ A V DRM I DRM |
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