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LM2433 데이터시트(PDF) 7 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
부품명 LM2433
상세설명  220V Monolithic Single Channel 16 MHz EDTV CRT Driver
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제조업체  NSC [National Semiconductor (TI)]
홈페이지  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2433 데이터시트(HTML) 7 Page - National Semiconductor (TI)

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Application Hints (Continued)
EFFECT OF OFFSET
Figure 7 shows the variation in rise and fall times when the
DC offset of the 110V
PP output swing is varied between
120V and 150V
DC. The rise time and fall time show a maxi-
mum variation of about 6% relative to the center data point
(135V
DC), which is a relatively small variation in speed over
the 30V DC offset range.
THERMAL CONSIDERATIONS
Figure 8 shows the performance of the LM2433 as a function
of case temperature. The figure shows that the rise and fall
times of the LM2433 increase by approximately 4.5% and
6.5%, respectively, as the case temperature increases from
40˚C to 90˚C. This corresponds to a speed degradation of
about 0.9% and 1.3% for every 10˚C rise in case tempera-
ture, which is very stable performance over the temperature
range.
POWER DISSIPATION AND HEATSINK CALCULATION
Worst-Case Power Dissipation
Figure 9 shows the maximum power dissipation of the
LM2433 vs. square wave frequency when the device uses
V
CC of 220V and is driving a 10 pF load with 110VPP swing
alternating one pixel on, one pixel off signal. Note that the
frequency range shown in the power dissipation figure is
one-half the actual pixel frequency. The graph assumes 80%
active time (device operating at the specified frequency),
which is typical in an EDTV application. The other 20% of the
time the device is assumed to be sitting at the black level
(190V in this case). Under this worst-case condition, the
maximum power dissipated by the LM2433 is about 6.8W at
around 40 MHz. It is important to note that this power dissi-
pation is a result of a high frequency square wave input,
which is unrealistic in practical TV applications. The band-
width of the input source used to drive the LM2433 was over
300 MHz. Using a RGB video processor or preamplifier with
less bandwidth will cause the LM2433 to dissipate less
power than shown in Figure 9 at the same conditions.
A Practical Approach to Power Dissipation
The power curve (Figure 9) mentioned previously shows the
LM2433 power dissipation for square wave frequencies
ranging from 1 to 50 MHz at 110V
PP swing. In practice, it is
uncommon for a TV to display average frequency content
over the entire picture exceeding 20 MHz. Therefore, it is
important to establish the worst-case picture condition under
normal viewing to give a realistic maximum power dissipa-
tion for the LM2433. Here is one approach:
An EDTV signal generator pattern that yields a practical
worst-case picture condition is a “multi-burst” pattern that
consists of a 1-to-30 MHz sine wave sweep over each of the
active lines. The power dissipated by the LM2433 as a result
of this picture condition can be approximated by taking the
average of the power between 1 to 30 MHz in Figure 9. This
average is 5.1W. Because a square wave input was used to
generate this power curve, a sine wave would cause the
LM2433 to dissipate slightly less power, say 5.0W. This is
one common way to determine a practical figure for maxi-
mum power dissipation. It is the system designer’s respon-
sibility to establish the worst-case picture condition for his
particular application and measure dissipation under that
condition to choose a proper heatsink.
Heatsink Calculation Example
Once the maximum dissipation is known, Figure 10 can be
used to determine the heatsink requirement for the LM2433.
If the 1-to-30 MHz multi-burst test described previously is
assumed to be worst-case picture condition that yields maxi-
mum dissipation, then the LM2433 will dissipate about 5.0W.
The power derating curve shows that the maximum allowed
case temperature is 127.5˚C when 5.0W is dissipated. If the
maximum expected ambient temperature is 65˚C, then the
maximum thermal resistance from device case-to-air (
θ
CA)
can be calculated:
θ
CA =(TCMAX –TAMAX)/PDMAX = θCS + θSA
θ
CA = (127.5˚C – 65˚C) / 5.0W = 12.5˚C/W.
θ
CS is the thermal resistance of the thermal compound at the
case-to-heatsink interface and
θ
SA is the thermal resistance
of the heatsink at the rated conditions.
This example assumes a capacitive load of 10 pF and no
resistive load. The designer should note that if the V
CC
supply voltage, output swing, input bandwidth, or load ca-
pacitance is increased, then the power dissipation will also
increase.
20146210
FIGURE 12. Recommended Application Circuit
www.national.com
7


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