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S71AL016D ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 76 Page - SPANSION

๋ถ€ํ’ˆ๋ช… S71AL016D
์ƒ์„ธ๋‚ด์šฉ  Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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Revision Summary
S71AL016D_02_04_00_A0 November 11, 2004
Advan ce
In form ati o n
Revision Summary
Revision A (September 27, 2004)
Initial release.
Revision A+1 (November 11, 2004)
Deleted parameter "tOES" at page 50,56.
Changed the symbol of " tLBZ, tUBZ" to " tLBLZ, tUBLZ" at page 63.
Trademarks and Notice
The contents of this document are subject to change without notice.This document may contain information on a SpansionTM product under development
by Spansion LLC. Spansion LLC reserves the right to change or discontinue work on any product without notice. The information in this document is provided
as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement
of third-party rights, or any other warranty, express, implied, or statutory. Spansion LLC assumes no liability for any damages of any kind arising out of the
use of the information in this document.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary
industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that
includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control,
medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable ( i.e., submersible repeater and
artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-men-
tioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other
abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
The contents of this document are subject to change without notice.This document may contain information on a SpansionTM product under development by
Spansion LLC. Spansion LLC reserves the right to change or discontinue work on any product without notice. The information in this document is provided
as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement
of third-party rights, or any other warranty, express, implied, or statutory. Spansion LLC assumes no liability for any damages of any kind arising out of the
use of the information in this document.
Copyright ยฉ 2004 Spansion LLC. All rights reserved.
SpansionTM, the SpansionTM logo, MirrorBit, combinations thereof, and ExpressFlash are trademarks of Spansion LLC. Other company and product names used
in this publication are for identification purposes only and may be trademarks of their respective companies.


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