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16 / 188 page 14 S71WS-Nx0 Based MCPs S71WS-N_01_A4 September 15, 2005 Ad van c e Inf o rmation 5 Connection Diagrams/Physical Dimensions This section contains the I/O designations and package specifications for the S71WS-N. 5.1 Special Handling Instructions for FBGA Packages Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning meth- ods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150° C for prolonged periods of time. |
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