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16 / 186 page 14 S71WS-J Based MCPs S71WS-J_04_A2 August 19, 2005 Pr elimi n ary Physical Dimensions TLA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 11.6 mm Package 3372-2 \ 16-038.22a PACKAGE TLA 084 JEDEC N/A D x E 11.60 mm x 8.00 mm PACKAGE SYMBOL MIN NOM MAX NOTE A --- --- 1.20 PROFILE A1 0.17 --- --- BALL HEIGHT A2 0.81 --- 0.97 BODY THICKNESS D 11.60 BSC. BODY SIZE E 8.00 BSC. BODY SIZE D1 8.80 BSC. MATRIX FOOTPRINT E1 7.20 BSC. MATRIX FOOTPRINT MD 12 MATRIX SIZE D DIRECTION ME 10 MATRIX SIZE E DIRECTION n 84 BALL COUNT Ø b 0.35 0.40 0.45 BALL DIAMETER eE 0.80 BSC. BALL PITCH eD 0.80 BSC BALL PITCH SD / SE 0.40 BSC. SOLDER BALL PLACEMENT A2,A3,A4,A5,A6,A7,A8,A9 DEPOPULATED SOLDER BALLS B1,B10,C1,C10,D1,D10, E1,E10,F1,F10,G1,G10, H1,H10,J1,J10,K1,K10,L1,L10, M2,M3,M4,M5,M6,M7,M8,M9 NOTES: 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 9. N/A 10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. C 0.08 0.20 C A E B C 0.15 (2X) C D C 0.15 (2X) INDEX MARK 10 6 b TOP VIEW SIDE VIEW CORNER 84X A1 A2 A 0.15 C A B M C M 0.08 PIN A1 ML E1 7 SE A D1 eD DC E F G H J K 10 8 9 7 6 4 3 2 1 eE 5 B PIN A1 CORNER 7 SD BOTTOM VIEW |
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