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PDM41028
2
Rev. 2.2 - 4/29/98
Absolute Maximum Ratings (1)
NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. Appropriate thermal calculations should be performed in all cases and specifically for
those where the chosen package has a large thermal resistance (e.g., TSOP). The cal-
culation should be of the form: Tj = Ta + P * θja where Ta is the ambient temperature, P
is average operating power and
θ
ja the thermal resistance of the package. For this
product, use the following
θ
ja values:
SOJ: 76o C/W
TSOP: 100o C/W
Symbol
Rating
Com’l.
Ind.
Unit
VTERM
Terminal Voltage with Respect to VSS
–0.5 to +7.0
–0.5 to +7.0
V
TBIAS
Temperature Under Bias
–55 to +125
–65 to +135
°C
TSTG
Storage Temperature
–55 to +125
–65 to +150
°C
PT
Power Dissipation
1.0
1.0
W
IOUT
DC Output Current
50
50
mA
Tj
Maximum Junction Temperature (2)
125
145
°C
Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
12
15
16
17
18
19
20
21
22
23
24
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
CE
OE
Vss
Vcc
A6
A5
A4
A3
A2
A1
A0
NC
I/O3
I/O2
I/O1
I/O0
WE
13
14
25
26
27
28
Pin Description
Name
Description
A17-A0
Address Inputs
I/O3-I/O0
Data Inputs/Outputs
OE
Output Enable Input
WE
Write Enable Input
CE
Chip Enable Input
NC
No Connect
VCC
Power (+5V)
VSS
Ground
Truth Table(1)
NOTE: 1. H = VIH, L = VIL, X = DON’T CARE
OE
WE
CE
I/O
MODE
X
X
H
Hi-Z
Standby
LH
L
DOUT
Read
XL
L
DIN
Write
H
H
L
Hi-Z
Output Disable
SOJ
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