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NCP2990 데이터시트(HTML) 1 Page - ON Semiconductor

부품명 NCP2990
상세내용  1.3 Watt Audio Power Amplifier with Fast Turn On Time
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제조사  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
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NCP2990 데이터시트(HTML) 1 Page - ON Semiconductor

 
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© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 0
1
Publication Order Number:
NCP2990/D
NCP2990
1.3 Watt Audio Power
Amplifier with Fast Turn On
Time
The NCP2990 is an audio power amplifier designed for portable
communication device applications such as mobile phone
applications. The NCP2990 is capable of delivering 1.3 W of
continuous average power to an 8.0
W BTL load from a 5.0 V power
supply, and 1.0 W to a 4.0
W BTL load from a 3.6 V power supply.
The NCP2990 provides high quality audio while requiring few
external components and minimal power consumption. It features a
low−power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
The NCP2990 contains circuitry to prevent from “pop and click”
noise that would otherwise occur during turn−on and turn−off
transitions. It is a zero pop noise device when a single ended audio
input is used.
For maximum flexibility, the NCP2990 provides an externally
controlled gain (with resistors), as well as an externally controlled
turn−on time (with the bypass capacitor). When using a 1
mF bypass
capacitor, it offers 60 ms wake up time.
Due to its superior PSRR, it can be directly connected to the
battery, saving the use of an LDO.
This device is available in a 9−Pin Flip−Chip CSP (Lead−Free).
Features
1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply
Superior PSRR: Direct Connection to the Battery
Zero Pop Noise Signature with a Single Ended Audio Input
Ultra Low Current Shutdown Mode: 10 nA
2.2 V−5.5 V Operation
External Gain Configuration Capability
External Turn−on Time Configuration Capability:
60 ms (1
mF Bypass Capacitor)
Up to 1.0 nF Capacitive Load Driving Capability
Thermal Overload Protection Circuitry
This is a Pb−Free Device*
Typical Applications
Portable Electronic Devices
PDAs
Wireless Phones
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
9−Pin Flip−Chip CSP
FC SUFFIX
CASE 499E
PIN CONNECTIONS
MBA
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
MARKING
DIAGRAMS
A3
B3
C3
A2
B2
C2
A1
B1
C1
INM
OUTA
INP
VM_P
VM
Vp
BYPASS
OUTB SHUTDOWN
9−Pin Flip−Chip CSP
(Top View)
1
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
ORDERING INFORMATION
MBA
G
AYWW
A1
A3
C1
http://onsemi.com


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