NTLJF3117P datasheet(1/8 Pages) ONSEMI

부품명	NTLJF3117P

상세설명	Power MOSFET and Schottky Diode ??0 V, ??.1 A, P?묬hannel, with 2.0 A Schottky Barrier Diode, 2x2 mm, uCool Package

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홈페이지	http://www.onsemi.com

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July, 2006 − Rev. 2

1

Publication Order Number:

NTLJF3117P/D

NTLJF3117P

Power MOSFET and

Schottky Diode

−20 V, −4.1 A, P−Channel, with 2.0 A

Schottky Barrier Diode, 2x2 mm,

mCool] Package

Features

• FETKYt Configuration with MOSFET plus Low Vf Schottky Diode

• mCOOLt Package Provides Exposed Drain Pad for Excellent

Thermal Conduction

• 2x2 mm Footprint Same as SC−88 Package Design

• Independent Pinout Provides Circuit Design Flexibility

• Low Profile (< 0.8 mm) for Easy Fit in Thin Environment

• High Current Schottky Diode: 2 A Current Rating

• This is a Pb−Free Device

Applications

• Optimized for Portable Applications like Cell Phones, Digital

Cameras, Media Players, etc.

• DC−DC Buck Circuit

• Li−Ion Battery Applications

• Color Display and Camera Flash Regulators

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Parameter

Symbol

Value

Unit

Drain−to−Source Voltage

VDSS

−20

V

Gate−to−Source Voltage

VGS

±8.0

V

Continuous Drain

Current (Note 1)

Steady

State

TA = 25°C

ID

−3.3

A

TA = 85°C

−2.4

t

≤ 5 s

TA = 25°C

−4.1

Power Dissipation

(Note 1)

Steady

State

TA = 25°C

PD

1.5

W

t

≤ 5 s

2.3

Continuous Drain

Current (Note 2)

Steady

State

TA = 25°C

ID

−2.3

A

TA = 85°C

−1.6

Power Dissipation

(Note 2)

TA = 25°C

PD

0.71

W

Pulsed Drain Current

tp = 10 ms

IDM

−20

A

Operating Junction and Storage Temperature

TJ, TSTG

−55 to

150

°C

Source Current (Body Diode) (Note 2)

IS

−1.9

A

Lead Temperature for Soldering Purposes

(1/8

″ from case for 10 s)

TL

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq

[1 oz] including traces).

2. Surface Mounted on FR4 Board using the minimum recommended pad size

of 30 mm2, 2 oz Cu.

1

2

3

6

5

4

A

N/C

D

K

G

S

http://onsemi.com

−20 V

30 V

135 m

W @ −2.5 V

100 m

W @ −4.5 V

2.0 A

RDS(on) MAX

−4.1 A

0.47 V

ID MAX (Note 1)

V(BR)DSS

MOSFET

SCHOTTKY DIODE

VR MAX

IF MAX

VF TYP

200 m

W @ −1.8 V

G

S

P−CHANNEL MOSFET

D

K

A

SCHOTTKY DIODE

JH

= Specific Device Code

M

= Date Code

G

= Pb−Free Package

(Note: Microdot may be in either location)

JHM

G

1

2

3

6

5

4

WDFN6

CASE 506AN

MARKING

DIAGRAM

(Top View)

1

See detailed ordering and shipping information in the package

dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

PIN CONNECTIONS

K

D

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