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AD8387 데이터시트(PDF) 5 Page - Analog Devices |
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AD8387 데이터시트(HTML) 5 Page - Analog Devices |
5 / 16 page AD8387 Rev. 0 | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Supply Voltages AVCCx − AGNDx 18 V DVCC − DGND 4.5 V Input Voltages Maximum Digital Input Voltage DVCC + 0.5 V Minimum Digital Input Voltage DGND − 0.5 V Maximum Analog Input Voltage AVCC + 0.5 V Minimum Analog Input Voltage AGND − 0.5 V Internal Power Dissipation1 TQFP E-Pad @ TA = 25°C 4.38 W Operating Temperature Range 0°C to 85°C Storage Temperature Range −65°C to +125°C Lead Temperature Range (Soldering 10 sec) 300°C 1 80-lead TQFP E-Pad: θJA = 28.5°C/W (still air) [JEDEC Standard, 4-layer PCB in still air] θJC = 12.2°C/W θJB = 14.6°C/W ΨJB = 12.0°C/W ΨJT = 0.3°C/W. Stresses above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to the absolute maximum ratings for extended periods may reduce device reliability. EXPOSED PADDLE To ensure optimized thermal performance, the exposed paddle must be thermally connected to an external plane, such as AVCC or GND, as described in the Applications section. OVERLOAD PROTECTION The AD8387 overload protection circuit consists of an output current limiter and a thermal switch. When TSW is LOW, the thermal switch is disabled and the output current limiter is enabled. The maximum current at any one output is internally limited to 100 mA average. In the event of a momentary short-circuit between a video output and a power supply rail (VCC or AGND), the output current limit is sufficiently low to provide temporary protection. When TSW is HIGH, the output current limiter, as well as the thermal switch, is enabled. The thermal switch debiases the output amplifier when the junction temperature reaches the internally set trip point. In the event of an extended short- circuit between a video output and a power supply rail, the output amplifier current continues to switch between 0 and 100 mA typical with a period determined by the thermal time constant and the hysteresis of the thermal trip point. The thermal switch, when enabled, provides long-term protection from accidental shorts during the assembly process by limiting the average junction temperature to a safe level. MAXIMUM POWER DISSIPATION The maximum power that the AD8387 can safely dissipate is limited by its junction temperature. The maximum safe junction temperature for plastic encapsulated devices, as determined by the glass transition temperature of the plastic, is approximately 150°C. Exceeding this limit temporarily can cause a shift in the parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 150°C for an extended period can result in device failure. OPERATING TEMPERATURE RANGE To ensure operation within the specified operating temperature range, it is necessary to limit the maximum power dissipation as follows. STILL AIR 200LFM 500LFM 1.0 3.0 50 55 60 65 70 75 80 85 90 100 95 75 80 85 90 95 100 105 110 115 125 120 AMBIENT TEMPERATURE ( °C) THERMAL SWITCH DISABLED ENABLED 2.5 2.0 1.5 QUIESCENT Figure 3. Maximum Power Dissipation vs. Temperature, AD8387 on a 4-Layer JEDEC PCB with Thermally Optimized Landing Pattern as Described in the Applications Section ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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