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OPA2604 데이터시트(HTML) 3 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation.
부품명 OPA2604
상세내용  Dual FET-Input, Low Distortion OPERATIONAL AMPLIFIER
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제조사  BURR-BROWN [Burr-Brown (TI)]
홈페이지  http://www.burr-brown.com
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OPA2604 데이터시트(HTML) 3 Page - Burr-Brown (TI)

 
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OPA2604
®
PIN CONFIGURATION
1
2
3
4
Output A
–In A
+In A
V–
8
7
6
5
V+
Output B
–In B
+In B
Top View
DIP/SOIC
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply Voltage .......................................................................
±25V
Input Voltage ............................................................. (V–)–1V to (V+)+1V
Output Short Circuit to Ground ............................................... Continuous
Operating Temperature ................................................. –40
°C to +100°C
Storage Temperature ..................................................... –40
°C to +125°C
Junction Temperature .................................................................... +150
°C
Lead Temperature (soldering, 10s) AP ......................................... +300
°C
Lead Temperature (soldering, 3s) AU .......................................... +260
°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
ELECTROSTATIC
DISCHARGE SENSITIVITY
Any integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet published speci-
fications.
ORDERING INFORMATION
PRODUCT
PACKAGE
TEMP. RANGE
OPA2604AP
8-Pin Plastic DIP
–25
°C to +85°C
OPA2604AU
SO-8 Surface-Mount
–25
°C to +85°C
PACKAGING INFORMATION
PACKAGE DRAWING
PRODUCT
PACKAGE
NUMBER(1)
OPA2604AP
8-Pin Plastic DIP
006
OPA2604AU
SO-8 Surface-Mount
182
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.


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