전자부품 데이터시트 검색엔진
  Korean  ▼

Delete All
ON OFF
ALLDATASHEET.CO.KR

X  

Preview PDF Download HTML

TPA6030A4 데이터시트(HTML) 25 Page - Texas Instruments

부품명 TPA6030A4
상세내용  3-2 STEREO AUDIO POWER AMPLIFIER WITH ADVANCED DC VOLUME CONTROL
Download  30 Pages
Scroll/Zoom Zoom In 100% Zoom Out
제조사  TI [Texas Instruments]
홈페이지  http://www.ti.com
Logo 

TPA6030A4 데이터시트(HTML) 25 Page - Texas Instruments

Zoom Inzoom in Zoom Outzoom out
/ 30 page
 25 / 30 page
background image
TPA6030A4
SLOS395B − DECEMBER 2002 − REVISED JANUARY 2005
www.ti.com
25
Figure 28
0
−20
−60
0.25 0.5
1
1.5
2
2.5
3
60
80
100
3.5
4
4.5
5
40
25
−40
20
MAXIMUM AMBIENT TEMPERATURE
vs
OUTPUT POWER (PER CHANNEL)
PO − Output Power (Per Channel) − W
RL = 8 Ω,
Derating Factor 61 mW/°C
RL = 16 Ω,
Derating Factor 35.8 mW/°C
RL = 8 Ω,
Derating Factor 35.8 mW/°C
TA = 25°C
VCC = 12 V
Stereo Operation
Bridge Tied (BTL)
Figure 29
−20
0
20
40
60
80
100
0.25
1
2
3
4
5
25
MAXIMUM AMBIENT TEMPERATURE
vs
OUTPUT POWER (PER CHANNEL)
PO − Output Power (Per Channel) − W
0.5
1.5
2.5
3.5
4.5
VCC = 15 V,
RL = 16 Ω,
Stereo Operation
Bridge Tied (BTL)
TA = 25°C
Derating Factor 48 mW/°C
Derating Factor 35.8 mW/°C
Figure 30
0
20
40
60
80
100
120
140
160
0.25
0.5
1
1.5
2
2.5
3
3.5
RL = 32 Ω
RL = 4 Ω
RL = 16 Ω
RL = 8 Ω
VCC = 12 V,
Derating Factor = 35.8 mW/°C
Stereo Operation
Single Ended (SE)
MAXIMUM AMBIENT TEMPERATURE
vs
OUTPUT POWER (PER CHANNEL)
PO − Output Power (Per Channel) − W
Figure 31
−20
0
20
40
60
80
100
120
140
0.25 0.5
1
1.5
2
2.5
RL = 4 Ω
TA = 25°C
VCC = 15 V,
Derating Factor = 35.8 mW/°C
Stereo Operation
Single Ended (SE)
MAXIMUM AMBIENT TEMPERATURE
vs
OUTPUT POWER (PER CHANNEL)
PO − Output Power (Per Channel) − W
3
3.5
4
4.5
5
RL = 32 Ω
RL = 8 Ω
RL = 16 Ω
The derating factor is crucial for proper thermal performance. The higher the derating factor, the more power can be
dissipated from the device. Board layout affects the derating factor, and should be optimized to achieve the best thermal
performance. Using boards with large copper planes that are uncut by signal or power paths help tremendously. Using
heavier copper, 2 oz. as opposed to 1 oz., is also beneficial. Placing the device close to a fan is another way to enhance
thermal performance. Most importantly, the PowerPAD must be properly soldered down. Refer to the PowerPAD Thermally
Enhanced Package application note (SLMA002).


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30 


데이터시트 Download




링크 URL



Privacy Policy
ALLDATASHEET.CO.KR
ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ]  

Alldatasheet는?   |   광고문의    |   운영자에게 연락하기   |   개인정보취급방침   |   즐겨찾기   |   링크교환   |   제조사별 검색
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn