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CS52015-1GSTR3 데이터시트(PDF) 6 Page - ON Semiconductor |
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CS52015-1GSTR3 데이터시트(HTML) 6 Page - ON Semiconductor |
6 / 9 page CS52015−1 http://onsemi.com 6 Protection Diodes When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which VIN drops. In the CS52015−1 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 13 is recommended. Figure 13. Protection Diode for Large Output Capacitors VIN CS52015−1 VOUT Adj R1 R2 VOUT VIN C1 C2 CAdj IN4002 (Optional) Output Voltage Sensing Since the CS52015−1 is a three terminal regulator, it is not possible to provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load. For the adjustable regulator, the best load regulation occurs when R1 is connected directly to the output pin of the regulator as shown in Figure 14. If R1 is connected to the load, RC is multiplied by the divider ratio and the effective resistance between the regulator and the load becomes. RC R1 ) R2 R1 where RC = conductor parasitic resistance. Figure 14. Grounding Scheme for Adjustable Output Regulator to Minimize Parasitic Resistance Effects VIN VIN VOUT Adj CS52015−1 Conductor Parasitic Resistance R1 RLOAD R2 RC Calculating Power Dissipation and Heat Sink Requirements The CS52015−1 linear regulator includes thermal shutdown and current limit circuitry to protect the device. High power regulators such as these usually operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate heat sink is used. The case is connected to VOUT on the CS52015−1, electrical isolation may be required for some applications. Thermal compound should always be used with high current regulators such as these. The thermal characteristics of an IC depend on the following four factors: 1. Maximum Ambient Temperature TA (°C) 2. Power dissipation PD (Watts) 3. Maximum junction temperature TJ (°C) 4. Thermal resistance junction to ambient RqJA (°C/W) These four are related by the equation TJ + TA ) PD RQJA (1) The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is: PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ (2) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application IQ is the maximum quiescent current at IOUT(max). A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine RqJA, the total thermal resistance between the junction and the surrounding air. 1. Thermal Resistance of the junction to case, RqJC (°C/W) 2. Thermal Resistance of the case to Heat Sink, RqCS (°C/W) 3. Thermal Resistance of the Heat Sink to the ambient air, RqSA (°C/W) These are connected by the equation: RQJA + RQJC ) RQCS ) RQSA (3) |
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