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74FST3383 데이터시트(PDF) 8 Page - ON Semiconductor

부품명 74FST3383
상세설명  10?묪it Low Power Bus Exchange
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74FST3383 데이터시트(HTML) 8 Page - ON Semiconductor

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PACKAGE DIMENSIONS
QSOP−24
QS SUFFIX
CASE 492B−01
ISSUE O
MIN
MILLIMETERS
G
R
−B−
−A−
L
M
0.25 (0.010)
T
U
−T−
SEATING
PLANE
K
D
24 PL
C
M
0.25 (0.010)
T BA
S
S
V
N
M
F
8 PL
DETAIL E
DETAIL E
H x 45_
RAD.
MOLD PIN
DIM
MAX
MIN
MAX
INCHES
A
8.56
8.74
0.337
0.344
B
3.81
3.99
0.150
0.157
C
1.55
1.73
0.061
0.068
D
0.20
0.31
0.008
0.012
F
0.41
0.89
0.016
0.035
G
0.64 BSC
0.025 BSC
H
0.20
0.46
0.008
0.018
J
0.249
0.191
0.0098 0.0075
K
0.10
0.25
0.004
0.010
L
5.84
6.20
0.230
0.244
M
0
8
0
8
N
0
7
0
7
P
0.69
0.94
0.027
0.037
Q
0.89 DIA
0.035 DIA
R
0.89
1.14
0.035
0.045
U
0.89
1.14
0.035
0.045
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN
THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE
ONLY). BOTTOM PACKAGE DIMENSION SHALL
FOLLOW THE DIMENSION STATED IN THIS
DRAWING.
4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 6 MILS PER
SIDE.
5. BOTTOM EJECTOR PIN WILL INCLUDE THE
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D.
__
_
_
0
8
0
__
_
8
_
__
__
MARK
Q
P
0.013 X 0.005
DP. MAX
RAD.
0.005−0.010
TYP
J
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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74FST3383/D
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