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MC74AC240 ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 10 Page - ON Semiconductor

๋ถ€ํ’ˆ๋ช… MC74AC240
์ƒ์„ธ๋‚ด์šฉ  Octal Buffer/Line Driver with 3−State Outputs
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10
PACKAGE DIMENSIONS
SOEIAJโˆ’20
M SUFFIX
CASE 967โˆ’01
ISSUE A
DIM
MIN
MAX
MIN
MAX
INCHES
โˆ’โˆ’โˆ’
2.05
โˆ’โˆ’โˆ’
0.081
MILLIMETERS
0.05
0.20
0.002
0.008
0.35
0.50
0.014
0.020
0.15
0.25
0.006
0.010
12.35
12.80
0.486
0.504
5.10
5.45
0.201
0.215
1.27 BSC
0.050 BSC
7.40
8.20
0.291
0.323
0.50
0.85
0.020
0.033
1.10
1.50
0.043
0.059
0
0.70
0.90
0.028
0.035
โˆ’โˆ’โˆ’
0.81
โˆ’โˆ’โˆ’
0.032
A1
HE
Q1
LE
_ 10_
0
_ 10_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
HE
A1
LE
Q1
_
c
A
Z
D
E
20
110
11
b
M
0.13 (0.005)
e
0.10 (0.004)
VIEW P
DETAIL P
M
L
A
b
c
D
E
e
L
M
Z
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