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BYD47-16 데이터시트(PDF) 2 Page - NXP Semiconductors

부품명 BYD47-16
상세설명  Fast soft-recovery controlled avalanche rectifiers
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제조업체  PHILIPS [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BYD47-16 데이터시트(HTML) 2 Page - NXP Semiconductors

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1999 Nov 11
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD47 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Shipped in 8 mm embossed tape
• Smallest surface mount
rectifier outline.
DESCRIPTION
Cavity free cylindrical glass SOD87
package through Implotec
(1)
technology. This package is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
ka
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRSM
non-repetitive peak reverse voltage
BYD47-16
1700
V
BYD47-18
1900
V
BYD47-20
2100
V
VRRM
repetitive peak reverse voltage
BYD47-16
1600
V
BYD47-18
1800
V
BYD47-20
2000
V
IF(AV)
average forward current
Ttp = 105 °C; see Fig.2;
averaged over any 20 ms period;
see also Fig.6
0.80
A
IF(AV)
average forward current
Tamb =25 °C; PCB mounting (see
Fig.11); see Fig.3;
averaged over any 20 ms period;
see also Fig.6
0.34
A
IFRM
repetitive peak forward current
Ttp =85 °C; see Fig.4
8.0
A
Tamb =65 °C; see Fig.5
2.8
A
IFSM
non-repetitive peak forward current
t = 10 ms half sine wave; Tj =Tj max
prior to surge; VR =VRRMmax
10
A
Tstg
storage temperature
−65
+175
°C
Tj
junction temperature
see Fig.7
−65
+175
°C


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