5

EDS-100632 Rev F

Preliminary

SGA-3263 DC-5500 MHz Cascadable MMIC Amplifier

303 Technology Court, Broomfield, CO 80021

Phone: (800) SMI-MMIC

http://www.sirenza.com

SOT-363 PCB Pad Layout

Dimensions in inches [millimeters]

RF

OUT

RF

I N

Notes:

1. Provide a large ground pad area under device

pins 1, 2, 4, & 5 with many plated via holes as

shown.

2. Dimensions given for 50 Ohm RF I/O lines are for

31 mil thick Getek. Scale accordingly for different

board thicknesses and dielectric contants.

3. We recommend 1 or 2 ounce copper. Measure-

ments for this data sheet were made on a 31 mil

thick Getek with 1 ounce copper on both sides.

SOT-363 Nominal Package Dimensions

Dimensions in inches [millimeters]

A link to the SOT-363 package outline drawing with full dimensions and

tolerances may be found on the product web page at www.sirenza.com.