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AM29F400BB-75DGI2 데이터시트(PDF) 11 Page - Advanced Micro Devices |
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AM29F400BB-75DGI2 데이터시트(HTML) 11 Page - Advanced Micro Devices |
11 / 12 page 10 Am29F400B Known Good Die SU PP L E ME NT REVISION SUMMARY Revision A (May 1997) Initial release. Revision B (January 1998) Formatted to match current template. Updated Distinc- tive Characteristics and General Description sections using the current main data sheet. Updated for CS39 process technology. Revision B+1 (February 1998) Distinctive Characteristics The minimum guarantee per sector is now 1 million cycles. Global Added -75 and -90 speed options. Pad Description Corrected coordinates for pads 2, 19, 22, 35, 40, and 42. Physical Specifications Changed die thickness specification to ~20 mils. Revision B+2 (May 1998) Die Pad Locations Moved AMD logo to above pad 23. Revision C (June 1998) Distinctive Characteristics Changed “Manufactured on 0.35 µm process technology” to “Manufactured on 0.32 µm process technology”. General Description Third paragraph: Changed “AMD’s 0.35 µm process technology” to “AMD’s 0.32 µm process technology”. Die Photograph Replaced with photograph of Die Revision 2. Die Pad Locations Corrected the location of the AMD logo to above pad 22 from pad above pad 13. Modified figure to match new die photograph. Pad Description Replaced table with new pad coordinates. Physical Specifications Die Dimensions: Changed to 135 mils x 198 mils, 3.43 mm x 5.03 mm from 141.34 mils x 207.48 mils, 3.59 mm x 5.27 mm. Die Thickness: Added ~500 µm. Pad Area Free of Passivation: Changed to 20.85 mils2 and 13,433 µm2 from 15.52 mils2 and 10,000 µm2. Passivation: Changed to SiN/SOG/SiN from Nitride/ SOG/Nitride. Manufacturing Information Manufacturing ID: Changed to 98F02AK (top boot) and 98F02ABK (bottom boot) from 98965AK (top boot) and 98965ABK (bottom boot). Fabrication Process: Changed to CS39S from CS39. Die Revision: Changed to 2 from 1. Revision C+1 (September 1998) Page 5, Ordering Information Package Type and Minimum Order Quantity: Changed Waffle Pack to 140 die per 5 tray stack from 180 die per 5 tray stack. Changed Gel-Pak® Die Tray to 594 die per 6 tray stack from 378 die per 6 tray stack. Changed Sur- ftape™ (Tape and Reel) to 2500 per 7-inch reel from 1800 per 7-inch reel. Page 7, Physical Specifications Die Dimensions: Changed to 3.42 mm x 5.02 mm from 3.43 mm x 5.03 mm. Bond Pad Size: Changed to 4.7 mils x 4.7 mils and 119.7 µm x 119.7 µm from 3.74 mils x 3.74 mils and 95 µm x 95 µm. Pad Area Free of Passivation: Changed to 13.98 mils2 and 9,025 µm2 from 20.85 mils2 and 13,433 µm2. Bond Pad Metallization: Changed to Al/Cu from Al/Cu/Si. Page 7, Manufacturing Information Manufacturing ID (Top Boot): Changed to 98F02AK from 98F02A. Revision D (November 1998) Global Revised document specifications for die shrink from 0.35 µm to 0.32 µm process technology. Terms and Conditions Replaced warranty with new version. Revision E (December 1998) Packaging Information Added section. Moved orientation information from die photograph section into this section. Revision E+1 (February 1999) Die Pad Locations Corrected top row of pad callouts. Revision E+2 (June 14, 1999) Physical Specifications Corrected the bond pad dimensions. |
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