전자부품 데이터시트 검색엔진 |
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FAN1589 데이터시트(PDF) 7 Page - Fairchild Semiconductor |
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FAN1589 데이터시트(HTML) 7 Page - Fairchild Semiconductor |
7 / 12 page PRODUCT SPECIFICATION FAN1589 REV. 1.0.5 11/10/03 7 Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for heat flow. Proper mounting ensures the best thermal flow from this area of the package to the heat sink. Use of a thermally conductive material at the case-to-heat sink interface is recommended. Use a thermally conductive spacer if the case of the device must be electrically isolated and include its contribution to the total thermal resistance. The case of the FAN1589 is directly connected to the output of the device. Figure 10. Application Circuit (FAN1589) FAN1589 U1 GND C3 100 µF VOUT 1.2V + C1 10 µF + VIN VOUT VIN 3.3V Table 1. Bill of Materials for Application Circuit for the FAN1589 Item Quantity Manufacturer Part Number Description C1 1 Xicon L10V10 10µF, 10V Aluminum C3 1 Xicon L10V100 100µF, 10V Aluminum U1 1 Fairchild FAN1589T 2.7A Regulator |
유사한 부품 번호 - FAN1589_03 |
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유사한 설명 - FAN1589_03 |
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