전자부품 데이터시트 검색엔진 |
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FDS3570 데이터시트(PDF) 2 Page - Fairchild Semiconductor |
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FDS3570 데이터시트(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page FDS3570 Rev. C Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Drain-Source Avalanche Ratings (Note 2) WDSS Single Pulse Drain-Source Avalanche Energy VDD = 40 V, ID = 9 A 360 mJ IAR Maximum Drain-Source Avalanche Current 9 A Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 80 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C 77 mV/°C IDSS Zero Gate Voltage Drain Current VDS = 64 V, VGS = 0 V 1 µA IGSSF Gate-Body Leakage,Forward VGS = 20 V, VDS = 0 V 100 nA IGSSR Gate-Body Leakage,Reverse VGS = -20 V, VDS = 0 V -100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 22.4 4 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C -7 mV/°C RDS(on) Static Drain-Source On-Resistance VGS = 10 V, ID = 9 A VGS = 10 V, ID = 9 A, TJ = 125°C VGS = 6 V, ID = 8.4 A 0.015 0.027 0.016 0.020 0.038 0.023 Ω ID(on) On-State Drain Current VGS = 10 V, VDS = 5 V 25 A gFS Forward Transconductance VDS = 5 V, ID = 7.6 A 40 S Dynamic Characteristics Ciss Input Capacitance 2750 pF Coss Output Capacitance 280 pF Crss Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz 140 pF Switching Characteristics (Note 2) td(on) Turn-On Delay Time 20 32 ns tr Turn-On Rise Time 12 24 ns td(off) Turn-Off Delay Time 60 95 ns tf Turn-Off Fall Time VDD = 40 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω 24 38 ns Qg Total Gate Charge 54 76 nC Qgs Gate-Source Charge 9.6 nC Qgd Gate-Drain Charge VDS = 40 V, ID = 9 A, VGS = 10 V 14 nC Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current 2.1 A VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 2.1 A (Note 2) 0.72 1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0% a) 50 ° C/W when mounted on a 1 in2 pad of 2 oz. copper. b) 105 ° C/W when mounted on a 0.04 in2 pad of 2 oz. copper. c) 125 ° C/W when mounted on a minimum pad. |
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