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DAC7541AKP-BI 데이터시트(PDF) 3 Page - Burr-Brown (TI) |
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DAC7541AKP-BI 데이터시트(HTML) 3 Page - Burr-Brown (TI) |
3 / 10 page 3 ® DAC7541A TEMPERATURE RELATIVE MODEL PACKAGE RANGE ACCURACY (LSB) GAIN ERROR (LSB) DAC7541AJP Plastic DIP 0 °C to +70°C ±1 ±6 DAC7541AKP Plastic DIP 0 °C to +70°C ±1/2 ±1 DAC7541AJU Plastic SOIC 0 °C to +70°C ±1 ±6 DAC7541AKU Plastic SOIC 0 °C to +70°C ±1/2 ±1 BURN-IN SCREENING OPTION See text for details. ABSOLUTE MAXIMUM RATINGS(1) PIN CONNECTIONS VDD (Pin 16) to Ground ...................................................................... +17V VREF (Pin 17) to Ground ..................................................................... +25V VRPB (Pin 18) to Ground ..................................................................... ±25V Digital Input Voltage (pins 4-15) to Ground ............................... –0.4V, VDD VPIN 1, VPIN 2 to Ground ............................................................. –0.4V, VDD Power Dissipation (any Package): To +75 °C ..................................................................................... 450mW Derates above +75 °C .............................................................. –6mW/°C Lead Temperature (soldering, 10s) ................................................ +300 °C Storage Temperature: Plastic Package ......................................... +125 °C NOTE: (1) Stresses above those listed above may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. Top View DIP/SOIC ELECTROSTATIC DISCHARGE SENSITIVITY The DAC7541A is an ESD (electrostatic discharge) sensi- tive device. The digital control inputs have a special FET structure, which turns on when the input exceeds the supply by 18V, to minimize ESD damage. However, permanent damage may occur on unconnected devices subject to high energy electrostatic fields. When not in use, devices must be stored in conductive foam or shunts. The protective foam should be discharged to the destination socket before devices are removed. BURN-IN SCREENING Burn-in screening is an option available for the models in the Ordering Information table. Burn-in duration is 160 hours at the indicated temperature (or equivalent combination of time and temperature). All units are tested after burn-in to ensure that grade speci- fications are met. To order burn-in, add “-BI” to the base model number. PACKAGE INFORMATION PACKAGE DRAWING MODEL PACKAGE NUMBER(1) DAC7541JP Plastic DIP 218 DAC7541KP Plastic DIP 218 DAC7541JU Plastic SOIC 219 DAC7541KU Plastic SOIC 219 DAC7541JP-BI Plastic DIP 218 DAC7541KP-BI Plastic DIP 218 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book. DAC7541A 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 I OUT 1 I OUT 2 GND Bit 1 (MSB) Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 R FB V REF +V DD Bit 12 (LSB) Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 TEMPERATURE RELATIVE BURN-IN TEMP. MODEL PACKAGE RANGE ACCURACY (LSB) (160 Hours)(1) DAC7541AJP-BI Plastic DIP 0 °C to +70°C ±1 +85 °C DAC7541AKP-BI Plastic DIP 0 °C to +70°C ±1/2 +85 °C ORDERING INFORMATION |
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